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Why KIOXIA’s TLC 3D BiCS FLASH™ outperforms 2D MLC flash technology

Why KIOXIA’s TLC 3D BiCS FLASH™ outperforms 2D MLC flash technology

Why KIOXIA’s TLC 3D BiCS FLASH™ outperforms 2D MLC flash technology

Product catalog summary
Introduction
KIOXIA's TLC 3D BiCS FLASH™ technology is highlighted as a superior alternative to traditional 2D MLC flash technology, particularly in embedded applications where memory is a critical component.

Flash Memory Evolution
Flash memory manufacturers have historically increased data storage by storing multiple bits per cell, a method that expanded capacity without increasing die size. However, this approach accelerated wear and reduced the lifespan of flash memory, particularly with Multi-Level Cell (MLC) techniques.

3D Flash Technology
KIOXIA introduced 3D flash technology to overcome the limitations of 2D planar designs. By moving to a three-dimensional structure, starting with a 48-layer device, KIOXIA significantly improved capacity limitations.

Technological Advancements
3D BiCS FLASH™ employs a silicon-nitride isolator (charge trap) technology, which is thinner and less prone to degradation compared to traditional polycrystalline floating gates. This allows for larger memory cells and improved reliability.

Reliability and Longevity
3D BiCS FLASH™ using TLC offers a comparable lifespan to 2D MLC, making it a reliable choice for design engineers. For critical applications, some solutions still offer SLC partitions for storing essential code sections.

Future Outlook
The trend of storing multiple bits per cell is expected to continue, with KIOXIA expanding its production capabilities at the Yokkaichi Plant in Japan. This ensures that KIOXIA's flash memory technology will meet future demands for high-capacity and reliable memory solutions.

Contact Information
KIOXIA Europe GmbH, Hansaallee 181, 40549 Düsseldorf, Germany. Tel: +49-211-36877-0. More information can be found on their website.
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Catalog excerpts

Why KIOXIA’s TLC 3D BiCS FLASH™ outperforms 2D MLC flash technology-1

Why KIOXIA’s TLC 3D BiCS FLASH™ outperforms 2D MLC flash technology One of the most critical elements of any embedded application is its memory. After all, it’s where the program and the stored data all go. No wonder that engineers spend so much time during product development in the selection of this core component. In order to pack more data into each device, flash memory manufacturers have turned to storing more than one bit of data in each cell of memory. In 2D planar memory designs this provided the industry with a way of expanding memory capacity without increasing the die size. It was, however, not without some incurred cost. As design engineers are well-aware, flash memory wears out as its cells are erased and written. This means that the lifetime of flash memory is limited. Storing several bits of data per cell, using Multi-Level Cell (MLC) techniques, causes the memory cell to wear out faster than when using a Single-Level Cell (SLC) technique that stores one bit per cell. As a result, application areas with lifetime expectations of more than a decade, and those in the areas of high reliability and robustness, became reluctant to use anything other than SLC flash technolo

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Why KIOXIA’s TLC 3D BiCS FLASH™ outperforms 2D MLC flash technology-2

KIOXIA e-MMC Storage for Data-Intensive Driving To overcome the need to simply make larger die using 2D planar approaches, KIOXIA, the inventor of flash memory, launched 3D flash technology. Instead of relying on ever finer fabrication processes to deliver more memory cells per die, this new technique went into the third dimension. Starting with a 48-layer demonstration device, it became clear that this was a significant step in improving capacity limitations. In addition, these first devices also stored several bits per cell using a Triple-Level Cell (TLC) approach. This was made possible in...

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Why KIOXIA’s TLC 3D BiCS FLASH™ outperforms 2D MLC flash technology-3

recognized as offering the world’s largest flash memory production capacity. The use of techniques that store multiple bits per cell, such as TLC, to provide design engineers and consumers with the enormous memory capacities they are demanding will continue. Thanks to all the advancements in flash memory technology that KIOXIA is developing, you can be sure that your application’s memory will stand the test of time. Find out more about KIOXIA’s BiCS FLASH™ 3D flash memory technology here KIOXIA Europe GmbH Hansaallee 181, 40549 Düsseldorf, Germany Tel +49-211-36877-0 www.kioxia.com

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