Technical Specifications Summary

1. Dimensions and Materials
- Outer Diameter (OD): 2.5 mm to 3.0 mm
- Material: Stainless Steel Wire
- Rope Diameter (ID): 1.5 mm

2. Application Areas
- Designed for use in semicondutor wafer processing systems.
- Suitable for applications requiring support capabilities for positioning wafers.
- Applicable in mechanical movement, stretching, and support applications.

3. Technical Specifications
- Melting Point: 343 °C
- Flametardant Rating: VW-1
- Notched Impact Strength: ≥ 5 kJ
- Density: 1.32 g/cm³
- Tensile Strength: ≥ 101 MPa
- Flexural Modulus: 3.8 GPa
- Surface Resistivity: 10⁶ - 10⁹ Ω/sq

Key Points and Recommendations
- The stainless steel wire rope is optimized for high-cleanliness environments typical in semiconductor wafer handling.
- Mechanical properties such as tensile strength and flexural modulus ensure durability and flexibility.
- Flame retardant rating VW-1 indicates good resistance to flame propagation.
- Surface resistivity values suggest suitability for electrostatic discharge sensitive environments.

This summary captures the essential technical parameters and application contexts for the stainless steel wire rope used in semiconductor wafer processing systems, emphasizing its mechanical and electrical properties critical for performance and safety.