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FLEXIBLE CIRCUITS FOR AUTOMOTIVE LIGHTING

FLEXIBLE CIRCUITS FOR AUTOMOTIVE LIGHTING

Product catalog summary
Applications and Technology Offering
Our approach focuses on solving problems through dedicated research and application engineering tailored to meet specific requirements.
Future Roadmap
Thermal Management Without Dedicated Thermal Pad: We offer efficient heat management solutions that surpass the 3W/m-k metal core PCB industry benchmark, featuring flexible tails. Our technology supports dynamic stress for over 5 million actuations, suitable for adaptive light requirements and compliant with automotive tests for reliability and durability. It boasts an ultra-low X-Y coefficient of thermal expansion with LED positional accuracy of ±50µm. Additional features include ESD grounding of stiffeners and baseplates, and colored coverlays like black to reduce light diffraction. Delivery formats include Bare Flex, pre-punched carriers, assembled, and module assembly.
Advantages
  • Lower system cost compared to equivalent Metal Core Printed Circuit Boards (MCPCB).
  • Customizable patterns to meet design specifications, enabling brand signature styling.
  • Exceptional thermal management for high power LED/LASER components.
  • Incorporation of flexible tails to eliminate wire harnesses.
Flexible Circuits for Automotive Lighting
Our FPC-based technologies are used in automotive lighting for static and dynamic high beam, low beam applications, and daytime running lights.
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Catalog excerpts

FLEXIBLE CIRCUITS FOR AUTOMOTIVE LIGHTING-1

AUTOMOTIVE LIGHTING APPLICATIONS Automotive lighting are FPC based technologies used for static and dynamic high beam and low beam applications as well as daytime running lights. TECHNOLOGY OFFERING To suit your problems, we pride ourselves on solving issues through dedicated research and application engineering to meet your requirements. Efficient heat management with typical performance exceeding the 3W/m-k metal core PCB industry benchmark complete with flexible tails. Dynamic stress for over 5 million actuations to suit adaptive light requirements and Automotive test compliant for reliability and durability. Ultra-low X-Y coefficient of thermal expansion with LED positional accuracy of ±50µm. Lower system cost compared to equivalent Metal Core Printed Circuit Boards (MCPCB). ESD grounding of stiffeners and baseplates available and coloured coverlays such as black to reduce light diffraction. Customisable patterns to meet design specification with styling enabler for brand signature. Bare Flex, pre-punched carriers, assembled and module assembly delivery formats available. FUTURE ROADMAP THERMAL MANAGEMENT WITH NO DEDICATED THERMAL PAD SCAN THE QR CODE TO CONTACT OUR JOHNSON ELECTRIC REPRESENTATIVE Rev 2 - July 2022 Exceptional thermal management for high power LED/LASER components. Incorporation of flexible tails to eliminate wire harnesses.

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*Prices are pre-tax. They exclude delivery charges and customs duties and do not include additional charges for installation or activation options. Prices are indicative only and may vary by country, with changes to the cost of raw materials and exchange rates.