HBJC501I25-H610
2Pages

Catalog excerpts

Compact Fanless BOX PC Solutions Intel® Alder Lake-S Chip, Support LGA1700 CPU, DDR4 up to 64GB, Support 12~19V DC-in Rear Power Button Features • Intel® 12th/13th/14th LGA1700 Socket Core I3,I5,I7 Pentium Processor (Max 35W), Intel® Alder Lake-S H610 Chip • 2 x DDR4 3200MHz up to 64GB • 2 x Realtek® RTL8111H GbE • 1 x SATA III (6Gb/s), 1 x M.2 (M key 2242/2280, NVMe) • 1 x M.2 E key (2230, CNVi/PCI-Ex1/USB2.0) • 2 x RS232, 2 x RS232/422/485 (Support 5V/12V TTL), 4 x USB3.2 (Gen1), 2 x USB2.0 • 1x HDMI, 1x DP, Support Fanless cooling design • 12~19V DC-in Intel® LGA1700 Socket Core I3,I5,I7 Pentium Processor (Max 35W) Intel® Alder Lake-S H610 Chip SYSTEM MEMORY DISPLAY INTERFACE STORAGE DEVICE 1 x 2.5" SATA 6Gb/s internal drive bay (only support 2.5" HDD with a hight ≤ 10mm) 1 x M.2 M-key (2242/2280 PCI-Ex4 Gen.3 interface, NVMe) 2 x SMA Antenna Hole 1 x Power Button, Power LED 1 x DC jack 1 x HDMI 1 x DP 2 x USB2.0 2 x RJ45 4 x USB3.2 Gen.1 1 x Line-out 1 x MIC GND Hold 2 x RS232 2 x RS232/422/485 Windows® 10 Windows® 11 Linux POWER SUPPLY MB : DC 12~19V Input Adapter : AC100~240V / DC19V_6.32A_120W POWER REQUIREMENT MECHANICAL MOUNTING Desktop, Wallmount, Din Rail GROSS WEIGHT ENVIRONMENT & CERTIFICATION OPERATING TEMPERATURE -10°C ~ 50°C (14°F ~123°F) (Under the condition of using M.2 interface SSD) STORAGE TEMPERATURE OPERATING HUMIDITY • IoT Solution, Automation Industry, Network security Packing List Part Number Wall mount Screw Package Change according to shipping area Power cord

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Compact Fanless BOX PC Solutions Ordering Information Part Number OPERATING TEMP AUDIO STORAGE DISPLAY Note: All specifications are subject to change without notice.

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HBJC501I25-H610 2Pages

Catalog excerpts

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HBJC501I25-H610
2Pages