CROSS SECTION POLISHER
4Pages

Scientific / Metrology Instruments CROSS SECTION POLISHER CROSS SECTION POLISHER TM IB-10500HMS High Throughput Milling System

High Throughput Milling * High milling rate of cross-section achieved by the new ion source: 1.2 ( 2.4 times than the previous milling rate.) The high throughput milling system optimizes the ion source electrodes and enables higher accelerating voltages, thus improving the ion-beam current density. Our newly developed ion source achieves a high milling rate of cross-section of 1.2 mm/h or more (2.4 times than the previous milling rate.) Cross-section milling rate of the new ion source Specimen: Silicon wafer, Accelerating voltage: 10 kV, Milling time: 1 h High throughput specification: 1.2...

Large Area Milling * Planar Surface Milling of Larger Area The new high throughput milling system has enabled the irradiation of an ion beam onto a larger area of the specimen. Planar surface milling is effective to remove scratches generated on the specimen surface or crystalline strains, which are caused by mechanical polishing. Planar surface milling of a concrete Accelerating voltage: 10 kV, Milling time: 20 min Large-area planar surface milling was applied to a concrete with a width of 20 mm. After milling, polish scratches and contamination were removed, allowing for clear observation...

High throughput specification *1 *2 500 μm/h or more (accelerating voltage 8 kV) *3 1200 μm/h or more (accelerating voltage 10 kV) *4 Specimen swing function *5 Auto specimen swing by ± 30° Auto specimen swing by ± 30°, Angle setting swing Auto milling start mode Auto cooling milling start mode / Auto return to room temperature mode Specimen stage ultimate cooling temperature Cooling temperature settable range Specimen cooling time to reach –100 °C Specimen cooling retention time Milling speed Air isolation function Intermittent milling mode Ion beam irradiation time and stop time are...