www.connect.co.jp www.jccherry.com TO Package Test Socket,GD18 series Size18x32.9mm / 0.71x1.30" TO-263-7/D2-PAK Burn-in Test Kelvin Contact(option) Current Rating 12A Specifications Contact Resistance : 50mΩ max Current Rating : 12A at 25℃(Between Drain and Source) * 　　　　　　　　　　　　　 Room temperature with 30℃ T-Rise ・Withstanding Voltage : DC2000V 1min at 25℃(Between Drain and Source) Insulation Resistance : 500MΩmin at DC500V Operating Temperature : -40℃～+200℃ ** * Please contact us for the high current type. ** Including terminal temperature rise. TO-263-7/D2-PAK Package Test Socket How to order Acceptable Device 　Code 　Please refer to the code table below. 　N : No Kelvin Contact K : With Kelvin Contact Drain Gate Source Kelvin Source Terminal Pattern(Top View)*** Pattern.A *** Also possible to support other terminal patterns. Please contact us for more details. After conducting a simulation, we will decide which dimension to adopt and make a proposal. Probe Pins Through holes GK,DK,SK are for Kelvin contact. If Kelvin Contact is not required, these holes are not necessary. PC Board Layout(Top View)

www.connect.co.jp www.jccherry.com GD18 Test Socket Blank Product (Product without processing holes and shapes) Customize products not listed in this catalog could be processed by machining. Please let us know the specifications of the device. P/N will be informed after fixing specifications. (32.9) 31 Actual Size ●Acceptable device(Example) Typical dimension Able to support other device size. Please contact us for more information.

•Acceptable Device Table (T'ypical) GeneSiC SEMICONDUCTOR Although the device is listed, but it may not be compatible due to the large tolerance of the device dimension. Therfore, please send the sample of the device in advance and we will check the compatibility.