
www.connect.co.jp www.jccherry.com High-Reliability Image Sensor Vacuum Socket for CCD & CMOS Evaluation Board Features Compatible with vacuum environments and low outgassing. This solution is for the inspection, circuit verification, and development of PGA devices. Reduces damage to the motherboard and replacement needs due to upgrades. Compatible with various formats such as for manual use, and burn-in use. Specification Current Rating: 1A max Contact Resistance: 15mΩ max Operating Temperature: -35℃ to +150℃ Materials Socket pin: Copper Alloy, Au Plating over Ni Insulator: High-temperature Plastics mm PGA □□□ V -CMV S-P □□□ - □□□ Solder dip SD1: 2.54mm Pitch SD2: 1.27/1.78mm Pitch SD3: 1.27/1.78mm Pitch, Value type No. of Pins Our Factory Code Recommended Through Hole Dia. :φ0.7±0.05 Recommended Through Hole Dia. :φ0.5±0.05 Surface Mount SM1: 2.54mm Pitch SM2: 1.27/1.78mm Pitch SM3: 1.27/1.78mm Pitch, Value type IMX: Sony CIS: Teledyne eV2 XGS: ON Semiconductor Recommended Through Hole Dia. :φ0.55±0.05 PC Board Thickness t=1.6(Recommended) Please contact us if it is thicker than 1.6mm. ** Please check the precautions for use when mounting on the PC Board. (Refer to page 1N2) *** Since the inside of the pin is a through hole, please be careful of solder rising.
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