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  3. PGAxxxA-CMVS-Pxxx-xxx

PGAxxxA-CMVS-Pxxx-xxx
1 /5Pages

PGAxxxA-CMVS-Pxxx-xxx

PGAxxxA-CMVS-Pxxx-xxx
1 /5Pages

Catalog excerpts

PGAxxxA-CMVS-Pxxx-xxx-1

www.connect.co.jp www.jccherry.com High-Reliability Image Sensor Socket for CCD & CMOS Evaluation Board Solder dip SD1: 2.54mm Pitch SD2: 1.27mm Pitch SD3: 1.27mm Pitch, Value type Recommended Through Hole Dia. :φ0.7±0.05 SD1 Recommended Through Hole Dia. :φ0.55±0.05 SD3 Recommended Through Hole Dia. :φ0.5±0.05 SD2 Refer to the table on pages 2C10,2C11. Surface Mount SM1: 2.54mm Pitch SM2: 1.27mm Pitch SM3: 1.27mm Pitch, Value type PC Board Thickness t=1.6(Recommended) Please contact us if it is thicker than 1.6mm. ** Please check the precautions for use when mounting on the PC Board. (Refer to page 1N2) *** Since the inside of the pin is a through hole, please be careful of solder rising. mm

 Open the catalog to page 1
PGAxxxA-CMVS-Pxxx-xxx-2

www.connect.co.jp www.jccherry.com High-Reliability Image Sensor Socket for CCD & CMOS Evaluation Board

 Open the catalog to page 2
PGAxxxA-CMVS-Pxxx-xxx-3

www.connect.co.jp www.jccherry.com High-Reliability Image Sensor Socket for CCD & CMOS Evaluation Board

 Open the catalog to page 3
PGAxxxA-CMVS-Pxxx-xxx-4

High-Reliability Image Sensor Socket for CCD & CMOS Evaluation Board Bottom View Socket Lineup for Device(For PGA) Test Socket P/N Acceptable Device P/N (Example) Acceptable Device manufacturer

 Open the catalog to page 4
PGAxxxA-CMVS-Pxxx-xxx-5

www.connect.co.jp www.jccherry.com High-Reliability Image Sensor Socket for CCD & CMOS Evaluation Board Socket Lineup for Device(For PGA) Test Socket P/N Acceptable Device P/N (Example) Acceptable Device manufacturer

 Open the catalog to page 5

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Archived catalogs

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