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PDSA-NB195-S0504-RA

PDSA-NB195-S0504-RA
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PDSA-NB195-S0504-RA

Product catalog summary
Overview: This document provides technical specifications and guidelines for the PDSA-NB195-S0504-RA power transistor test sockets designed for high-temperature applications, specifically for TO-247 (4pin) configurations. The sockets are suitable for environments up to 250°C and feature low outgassing properties.
Specifications: The document outlines the dimensions and tolerances for the PC board layout, including specific measurements for soldering points and heat sink attachments. Key dimensions include a tolerance of ±0.05/0.002" and various measurements for component placement.
Procedures: Instructions are provided for ordering the sockets and using them in different configurations. The document details how to orient the device sideways to accommodate height restrictions on PC board layouts and offers guidance on extending components beyond the board's edge.
Recommendations: The document advises caution when attaching heat sinks to ensure proper alignment and height with the device. It also suggests methods for attaching heat sinks, either using the board as a heat sink or employing a separate heat sink, with specific notes on screw usage and device orientation.
Critical Information: Emphasis is placed on ensuring proper alignment and height when mounting the socket alone, as it is thinner than the device. The document also highlights the possibility of attaching the heat sink with the device's heat dissipation side facing upwards.
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Catalog excerpts

PDSA-NB195-S0504-RA-1

Power Transistor Test Sockets for High Temperature, Right Angle Features: The device can be oriented sideways to accommodate PC board layouts with height restrictions. In addition to the method of fastening the heat sink and device to the board, it is also possible to extend them beyond the edge of the PC board. TO-247 (4pin) High Temperature 250°C Low Outgassing How to order p <t> <t>— Tolerance : ±0. 05/0. 002' PC Board Layout (Top View) How to use OIn case of using the board as a heat sink * When attaching a heat sink to the back of the PC board or device, please be cautious about the position and dimensions. ** When mounting the socket alone, be aware that it is thinner than the device. Ensure proper height alignment with the device and heat sink set in place during installation. *** It is also possible to attach the heat sink with the device's backside (heat dissipation side) facing upwards.

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