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  3. PDHS545-NB195-S03-RA

PDHS545-NB195-S03-RA
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PDHS545-NB195-S03-RA

PDHS545-NB195-S03-RA
1 /1Page

Catalog excerpts

PDHS545-NB195-S03-RA-1

www.connect.co.jp www.jccherry.com Power Transistor Test Sockets,High Temperature, Right Angle High Temperature 250℃ Low Outgassing Features: The device can be oriented sideways to accommodate PC board layouts with height restrictions. In addition to the method of fastening the heat sink and device to the board, it is also possible to extend them beyond the edge of the PC board. PC Board Layout (Top View) Dielectric Strength Insulator Resistance * We have a track record of adoption up to the voltage levels specified. Please feel free to consult with us for more details. 〇In case of using the PC board as a heat sink 〇In case of using a separate heat sink Heat sink part t=4.6 max Heat Sink * When attaching a heat sink to the back of the PC board or device, please be cautious about the position and dimensions. ** When mounting the socket alone, be aware that it is thinner than the device. Ensure proper height alignment with the device and heat sink set in place during installation. *** It is also possible to attach the heat sink with the device's backside (heat dissipation side) facing

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