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PDHS545-NB195-S03-RA

PDHS545-NB195-S03-RA
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PDHS545-NB195-S03-RA

Product catalog summary
Overview: This document provides technical specifications and guidelines for using high-temperature power transistor test sockets, specifically designed for right-angle applications. The sockets are capable of withstanding high temperatures up to 250℃ and feature low outgassing properties.
Specifications:
  • Dielectric Strength: AC1500Vrms for 1 minute at 25℃, with a maximum of AC3000V.
  • Insulator Resistance: Minimum of 1000 MΩ at DC500V.
  • Pitch: 5.45mm/0.215".
PC Board Layout:
  • Top view dimensions and tolerances are provided, with a tolerance of ±0.05/0.002".
  • Key dimensions include 10.5/0.661", 6/0.484", and φ1/0.039" depth.
Heat Sink Usage:
  • Options for using the PC board as a heat sink or a separate heat sink are discussed.
  • When attaching a heat sink, ensure proper alignment and consider the position and dimensions.
  • The device can be oriented sideways to accommodate height restrictions on the PC board.
Installation Recommendations:
  • Ensure proper height alignment when mounting the socket alone, as it is thinner than the device.
  • It is possible to attach the heat sink with the device's backside facing upwards for heat dissipation.
Additional Notes:
  • Consultation is available for voltage levels beyond the specified range.
See more

Catalog excerpts

PDHS545-NB195-S03-RA-1

www.connect.co.jp www.jccherry.com Power Transistor Test Sockets,High Temperature, Right Angle High Temperature 250℃ Low Outgassing Features: The device can be oriented sideways to accommodate PC board layouts with height restrictions. In addition to the method of fastening the heat sink and device to the board, it is also possible to extend them beyond the edge of the PC board. PC Board Layout （Top View） Dielectric Strength Insulator Resistance * We have a track record of adoption up to the voltage levels specified. Please feel free to consult with us for more details. 〇In case of using the PC board as a heat sink 〇In case of using a separate heat sink Heat sink part t=4.6 max Heat Sink * When attaching a heat sink to the back of the PC board or device, please be cautious about the position and dimensions. ** When mounting the socket alone, be aware that it is thinner than the device. Ensure proper height alignment with the device and heat sink set in place during installation. *** It is also possible to attach the heat sink with the device's backside (heat dissipation side) facing

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