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Modular Socket PMS-5400P-S

Modular Socket PMS-5400P-S

Modular Socket PMS-5400P-S

Product catalog summary

Overview

The PMS series modular sockets are designed for power semiconductor packages, offering flexible layout options, Kelvin contact type, and high temperature variants. These sockets accommodate various package designs and support high current applications with reliable electrical and mechanical performance.

Key Features

  • Flexible placement in various layouts depending on package design.
  • Kelvin contact type for accurate current sensing.
  • High temperature type available, supporting operating temperatures up to 220°C.

Product Variants and Specifications

PMS-5400P-S Series

  • Minimum arrangement pitch: 5.4 mm.
  • Acceptable lead size: width up to 4.0 mm, thickness 0.3–1.0 mm, minimum lead length 3.0 mm.
  • Operating temperature: Standard -55 to +175°C; High Temperature (HT) -55 to +220°C.
  • Durability: Minimum 10,000 cycles.
  • Contact resistance: Maximum 20 mΩ.
  • Material: Thermoplastic housing; copper alloy contacts with gold plating over nickel.
  • Mounting method: Dual Inline Package (DIP), straight PCB mounting.

PMS-2540P-D Series

  • Minimum arrangement pitch: 5.08 mm.
  • Acceptable lead size: width up to 1.9 mm, thickness 0.3–1.0 mm, minimum lead length 3.0 mm.
  • Similar temperature and durability specifications as PMS-5400P-S.

Other Variants

  • PMS-4000P-S: Minimum pitch 4.0 mm, lead width max 3.1 mm.
  • PMS-1778P-S: Minimum pitch 1.778 mm, lead width max 1.2 mm.

Mechanical and Electrical Characteristics

  • Contact points designed with guide pins and screw holes for secure mounting.
  • PCB layouts provided for top view placement, including clearance holes for leads and mounting screws.
  • Temperature rise vs. current charts available for reference, indicating thermal performance under load.

Usage and Application Examples

  • Suitable for power transistors, SIP packages, and Intelligent Power Modules (IPM).
  • Examples of modular socket arrangements for various high current device packages such as TO-247 (4-pin), TO-3P, TO-220, TO-264, TO-257, and TO-262.
  • Recommended quantities of sockets per package type are provided to optimize layout and performance.

Ordering Information

  • Ordering format includes product code and quantity, e.g., PMS-5400P-S 3 pcs.
  • Note that nuts and screws are not included with the sockets.

Additional Notes

  • High temperature types have different specifications, including terminal temperature rise.
  • Custom substrate design and manufacturing services are available upon request.

Summary

The PMS series modular sockets provide a versatile and reliable solution for mounting power semiconductor devices. Their modular design, high durability, and thermal performance make them suitable for various power electronics applications. Detailed PCB layouts and current-temperature rise charts assist in optimal design integration.

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Catalog excerpts

Modular Socket PMS-5400P-S-1

www.connect.co.jp www.jccherry.com PMS series Modular Socket for Power Semiconductor Package For Power Transistor For SIP Package For Intelliget Power Module(IPM) Feature ○Placeable in various layouts depending on the package design. ○Kelvin contact type ○High temperature type Specifications  Durability : 10,000 cycles min. ・Contact resistance : 20mΩ max * Operating temperature : -55 to +175℃ * Including Terminal Temperature Rise. Materials & finish ・Housing : Thermoplastic Contact : Copper alloy Au Plating over Ni * Mounting method : DIP PCB Mounting direction : Straight * Specifications for High Temperature Type are Different. Acceptable Lead Size w=4.0(max) t=0.3 - 1.0mm L=3.0(min) PMS-5400P-S T-Rise Current Chart(Reference) 100 T-Rise(℃) PMS-5400P-S-□□ Blank: Standard HT: High Temperature -55 to +220℃ 15 Blank: Standard HT: High Temperature -55 to +220℃ PMS-2540P-D-HT T-Rise Current Chart(Reference) PMS-2540P-D T-Rise Current Chart(Reference) PC Board Layout (Top View) Minimum Arrangement Pitch 5.08mm Pitch ~ PMS-5400P-S-HT T-Rise Current Chart(Reference) Minimum Arrangement Pitch 5.4mm Pitch

 Open the catalog to page 1
Modular Socket PMS-5400P-S-2

Minimum Arrangement Pitch 4. 0mm Pitch — 2. 5 \/ PC Board Layout (Top View) ** Please refer to page 2L1 - 2L2 for PC Board Layout of each Modular Socket.

 Open the catalog to page 2
Modular Socket PMS-5400P-S-3

www.connect.co.jp www.jccherry.com 〇How to use Example) 2)Intelligent Power Modele (IPM) Layout for IPM package How to order ** PC Board layout (Top View) ** Please refer to page 2L1~2L2 for PC Board Layout of each Modular Socket. Please note that the nuts and screws are not included. We also design and manufacture substrates according to customer's specifications.Please feel free to contact us.

 Open the catalog to page 3
Modular Socket PMS-5400P-S-4

www.connect.co.jp www.jccherry.com 〇Examples of modular socket arrangement Examples of modular socket arrangement for high current device packages. Acceptable Module Socket Acceptable Module Socket Acceptable Module Socket

 Open the catalog to page 4

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*Prices are pre-tax. They exclude delivery charges and customs duties and do not include additional charges for installation or activation options. Prices are indicative only and may vary by country, with changes to the cost of raw materials and exchange rates.