Overview

The document details the PMS series modular sockets designed for power semiconductor packages. These sockets support various package designs with flexible layout options and feature Kelvin contact types and high-temperature variants.

Key Features

• Flexible placement for different package layouts.
• Kelvin contact type for precise electrical measurement.
• High temperature resistant versions available.

Product Variants and Specifications

PMS-5400P-S Series

• Minimum arrangement pitch: 5.4mm and above.
• Acceptable lead size: width up to 4.0mm, thickness 0.3-1.0mm, minimum length 3.0mm.
• Operating temperature: Standard -55 to +175°C; High Temperature (HT) up to +220°C.
• Durability: Minimum 10,000 cycles.
• Contact resistance: Maximum 20mΩ.
• Materials: Thermoplastic housing; copper alloy contacts with gold plating over nickel.
• Mounting method: Dual Inline Package (DIP), straight PCB mounting.

PMS-2540P-D Series

• Minimum arrangement pitch: 5.08mm and above.
• Acceptable lead size: width up to 1.9mm, thickness 0.3-1.0mm, minimum length 3.0mm.
• Similar temperature and durability specifications as PMS-5400P-S.

Other Variants

• PMS-4000P-S: Minimum pitch 4.0mm, lead width max 3.1mm.
• PMS-1778P-S: Minimum pitch 1.778mm, lead width max 1.2mm.

Mechanical and Electrical Characteristics

• Contact points and PCB layouts are provided with precise dimensions for each socket type.
• Guide pins and screw holes are specified for secure mounting.
• Temperature rise vs. current charts are included as reference for thermal performance under load.

Usage and Application Examples

• Layouts for various power transistor packages such as TO-247 (4-pin), TO-3P, TO-220, TO-264, TO-257, and TO-262 are illustrated.
• Examples of modular socket arrangements for high current device packages are provided, showing compatible socket types and quantities for different package pin counts (e.g., 8-pin, 12-pin).
• Instructions note that nuts and screws are not included with the sockets.

Ordering Information

• Ordering format includes product number and quantity (e.g., PMS-5400P-S, 1 piece).
• Multiple product variants can be ordered depending on package and application requirements.

Additional Notes

• Custom substrate design and manufacturing services are available upon request.
• PCB layouts for each modular socket type are referenced for detailed design integration.

Critical Parameters and Limitations

• Maximum contact resistance of 20mΩ ensures low electrical loss.
• Durability rating of at least 10,000 mating cycles supports long-term reliability.
• Operating temperature range varies by type, with high temperature versions supporting up to +220°C.
• Lead size compatibility must be observed to ensure proper fit and function.
• Thermal performance charts should be consulted to avoid overheating under current load.

Summary

The PMS series modular sockets provide versatile, reliable, and high-performance solutions for power semiconductor packaging. Their modular design, combined with high temperature tolerance and precise contact features, make them suitable for a wide range of power device applications. Detailed mechanical specifications and thermal performance data support effective integration into PCB designs.