www.connect.co.jp www.jccherry.com PMS series Modular Socket for Power Semiconductor Package For Power Transistor For SIP Package For Intelliget Power Module(IPM) Feature ○Placeable in various layouts depending on the package design. ○Kelvin contact type ○High temperature type Specifications 　Durability : 10,000 cycles min. ・Contact resistance : 20mΩ max * Operating temperature : -55 to +175℃ * Including Terminal Temperature Rise. Materials & finish ・Housing : Thermoplastic Contact : Copper alloy Au Plating over Ni * Mounting method : DIP PCB Mounting direction : Straight * Specifications for High Temperature Type are Different. Acceptable Lead Size w=4.0(max) t=0.3 - 1.0mm L=3.0(min) PMS-5400P-S T-Rise Current Chart(Reference) 100 T-Rise（℃） PMS-5400P-S-□□ Blank: Standard HT: High Temperature -55 to +220℃ 15 Blank: Standard HT: High Temperature -55 to +220℃ PMS-2540P-D-HT T-Rise Current Chart(Reference) PMS-2540P-D T-Rise Current Chart(Reference) PC Board Layout (Top View) Minimum Arrangement Pitch 5.08mm Pitch ～ PMS-5400P-S-HT T-Rise Current Chart(Reference) Minimum Arrangement Pitch 5.4mm Pitch

Minimum Arrangement Pitch 4. 0mm Pitch — 2. 5 \/ PC Board Layout (Top View) ** Please refer to page 2L1 - 2L2 for PC Board Layout of each Modular Socket.

www.connect.co.jp www.jccherry.com 〇How to use Example) 2)Intelligent Power Modele (IPM) Layout for IPM package How to order ** PC Board layout (Top View) ** Please refer to page 2L1～2L2 for PC Board Layout of each Modular Socket. Please note that the nuts and screws are not included. We also design and manufacture substrates according to customer's specifications.Please feel free to contact us.

www.connect.co.jp www.jccherry.com 〇Examples of modular socket arrangement Examples of modular socket arrangement for high current device packages. Acceptable Module Socket Acceptable Module Socket Acceptable Module Socket