

The document details the PMS series modular sockets designed for power semiconductor packages. These sockets support various package designs with flexible layout options and feature Kelvin contact types and high-temperature variants.
The series includes multiple socket models differentiated by pitch and application:
Each socket type specifies acceptable lead sizes (width, thickness, length), contact point dimensions, and PCB mounting layouts. For example, PMS-5400P-S accepts leads up to 4.0mm width and 0.3-1.0mm thickness with a minimum length of 3.0mm.
PCB layouts are provided with precise hole diameters and spacing to accommodate guide pins and screws (M1.6, M2, etc.). Clearance holes for leads are necessary.
Reference T-rise (temperature rise) vs. current charts are included for each socket type, indicating thermal limits and current carrying capacity. High temperature versions show improved thermal tolerance.
Examples demonstrate socket arrangements for various power semiconductor packages such as TO-247, TO-3P, TO-220, TO-264, and IPM modules. The document provides recommended quantities and combinations of socket types for different package pin counts (e.g., 8pin, 12pin).
Ordering format includes the product number and quantity, e.g., PMS-5400P-S 3pcs. Nuts and screws are not included and must be sourced separately.
The PMS series modular sockets provide versatile, durable, and thermally robust solutions for mounting power semiconductor devices. Their modularity and range of pitches accommodate various package types and layouts, with high temperature options for demanding applications. Detailed mechanical, electrical, and thermal specifications support precise design and integration into power electronics systems.
www.connect.co.jp www.jccherry.com PMS series Modular Socket for Power Semiconductor Package For Power Transistor For SIP Package For Intelliget Power Module(IPM) Feature ○Placeable in various layouts depending on the package design. ○Kelvin contact type ○High temperature type Specifications Durability : 10,000 cycles min. ・Contact resistance : 20mΩ max * Operating temperature : -55 to +175℃ * Including Terminal Temperature Rise. Materials & finish ・Housing : Thermoplastic Contact : Copper alloy Au Plating over Ni * Mounting method : DIP PCB Mounting direction : Straight * Specifications for High Temperature Type are Different. Acceptable Lead Size w=4.0(max) t=0.3 - 1.0mm L=3.0(min) PMS-5400P-S T-Rise Current Chart(Reference) 100 T-Rise(℃) PMS-5400P-S-□□ Blank: Standard HT: High Temperature -55 to +220℃ 15 Blank: Standard HT: High Temperature -55 to +220℃ PMS-2540P-D-HT T-Rise Current Chart(Reference) PMS-2540P-D T-Rise Current Chart(Reference) PC Board Layout (Top View) Minimum Arrangement Pitch 5.08mm Pitch ~ PMS-5400P-S-HT T-Rise Current Chart(Reference) Minimum Arrangement Pitch 5.4mm Pitch
Open the catalog to page 1Minimum Arrangement Pitch 4. 0mm Pitch — 2. 5 \/ PC Board Layout (Top View) ** Please refer to page 2L1 - 2L2 for PC Board Layout of each Modular Socket.
Open the catalog to page 2www.connect.co.jp www.jccherry.com 〇How to use Example) 2)Intelligent Power Modele (IPM) Layout for IPM package How to order ** PC Board layout (Top View) ** Please refer to page 2L1~2L2 for PC Board Layout of each Modular Socket. Please note that the nuts and screws are not included. We also design and manufacture substrates according to customer's specifications.Please feel free to contact us.
Open the catalog to page 3www.connect.co.jp www.jccherry.com 〇Examples of modular socket arrangement Examples of modular socket arrangement for high current device packages. Acceptable Module Socket Acceptable Module Socket Acceptable Module Socket
Open the catalog to page 41 Page
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