Overview

The document details the PMS series modular sockets designed for power semiconductor packages. These sockets support various package layouts, feature Kelvin contact types, and offer high-temperature variants. They are suitable for power transistors, SIP packages, and Intelligent Power Modules (IPM).

Key Features

• Flexible placement in various layouts depending on package design.
• Kelvin contact type for precise electrical measurement.
• High temperature type available, supporting operating temperatures up to 220°C.

Specifications

• Durability: Minimum 10,000 cycles.
• Contact Resistance: Maximum 20mΩ (standard type).
• Operating Temperature: -55°C to +175°C (standard), up to +220°C for high temperature type.
• Materials: Housing made of thermoplastic; contacts are copper alloy with gold plating over nickel.
• Mounting Method: Dual Inline Package (DIP) with straight PCB mounting direction.

Product Variants and Dimensions

The series includes multiple models with different pitch sizes and lead acceptances:

• PMS-5400P-S: Minimum arrangement pitch 5.4mm, suitable for power transistors and SIP packages. Acceptable lead size up to 4.0mm width, 0.3-1.0mm thickness, minimum 3.0mm length.
• PMS-2540P-D: Minimum pitch 5.08mm, designed for Intelligent Power Modules (IPM). Acceptable lead size up to 1.9mm width, 0.3-1.0mm thickness, minimum 3.0mm length.
• PMS-4000P-S: Minimum pitch 4.0mm, for TO-247 (4-pin) packages. Acceptable lead size up to 3.1mm width.
• PMS-1778P-S: Minimum pitch 1.778mm, for fine pitch applications with lead width up to 1.2mm.

Thermal Performance

Reference T-rise (temperature rise) current charts are provided for each model, indicating the relationship between current (in Amps) and temperature rise (in °C). High temperature variants show improved thermal tolerance.

Mechanical Details and PCB Layout

Detailed mechanical drawings specify contact points, guide pin diameters, screw hole sizes, and PCB layout dimensions. Clearance holes for leads and guide pins are defined to ensure proper mounting and alignment. Examples include:

• Guide pins typically φ1.2mm or φ1.7mm depending on model.
• Screw holes for M1.6 or M2 screws depending on socket type.
• Contact point depths and arrangement pitches are precisely dimensioned.

Usage Examples and Socket Arrangement

Examples illustrate how to arrange modular sockets for various power semiconductor packages such as TO-247, TO-3P, TO-220, TO-264, and IPM packages. The document provides recommended quantities of each socket type for different package pin counts (e.g., 8-pin, 12-pin) and configurations.

Ordering Information

Ordering format includes the product number and quantity, e.g., PMS-5400P-S 3pcs. Nuts and screws are not included and must be sourced separately.

Additional Notes

• Custom substrate design and manufacturing services are available upon request.
• PCB layouts for each modular socket are referenced and should be consulted for precise design.

Critical Parameters and Best Practices

• Ensure lead sizes conform to acceptable dimensions for reliable contact.
• Consider high temperature variants for applications exceeding 175°C operating temperature.
• Follow recommended PCB layout and clearance hole specifications to ensure mechanical stability and electrical performance.
• Use Kelvin contact type sockets for accurate current sensing and measurement.