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Manual test socket Image Sensor Sockets

Manual test socket Image Sensor Sockets

Manual test socket Image Sensor Sockets

Product catalog summary
Image Sensor Test Socket Features:
  • Designed for testing CCD and CMOS sensors, adaptable to various package types such as BGA, LGA, and PGA, and suitable for manual, handler, and burn-in processes.
  • Constructed from anti-reflective material with an aperture on the top surface.
  • Utilizes high-reliability spring probes, stamping pins, and socket pins for high current, durability, and speed interfaces.
Open Top Type:
  • Suitable for manual product evaluation and mass production with handlers.
  • Includes a probe pin socket for light sources beneath the socket and a device height variability absorption mechanism.
  • Supports high current and high-speed interfaces.
Specifications (Typical):
  • Pitch: 0.25mm and above.
  • Rate Current: 0.5A and above.
  • Contact Resistance: Maximum 200mΩ.
  • Dielectric Strength Voltage: AC100V rms for 1 minute.
  • Insulation Resistance: Minimum 1000MΩ at DC100V.
  • Temperature Range: -40℃ to +150℃.
For BGA, LGA:
  • Probe pin socket designed for high-speed interfaces with specific return and insertion loss values.
  • Return Loss (GSG): -14.01dB at 14.23GHz.
  • Insertion Loss (GSG): -1.0dB at 14.23GHz.
  • Self Inductance: 0.95nH.
  • Capacitance: 0.32pF.
Clamshell Type:
  • Used for manual product evaluation and mass production with handlers.
  • Features a probe pin socket for light sources above the socket.
PGA Device:
  • Includes PGA sockets and PC board configurations for SMT, Thru Hole, and Solder Dip.
  • Designed for various evaluation and mounting production processes.
  • Socket pin options include SMT type and Solder Dip type.
  • Stamping pin socket available for PGA with a pitch of 1.27mm and above.
See more

Catalog excerpts

Manual test socket Image Sensor Sockets-1

www.connect.co.jp www.jccherry.com Image Sensor Test Socket High current High speed interface Specification(typical) Features: pitch : 0.25mm ~ ●Test socket for CCD and CMOS sensor diversified in recent years. Rate Current : 0.5A ~ ●Customizable for various package like BGA, LGA, PGA Contact Resistance : 200mΩ max and for manual, handler and burn-in. Dielectric Strength Voltage : AC100V rms 1 min ●The test socket is made of anti-reflective material and it has Insulation Resistance : 1000MΩ min at DC100V an aperture on the top surface. Temperature Range : -40℃ ~ +150℃ ●Using our high reliable spring probes, stamping pins and socket pins,we manufacture test sockets for high current, high durability and high speed interface. Open top type For manual product evaluation and mass-production with handler A probe pin socket with device height variability absorption mechanism. A probe pin socket for the light source above of socket. A probe pin socket for the light source under of socket. Return loss Insertion loss A probe pin socket for the high speed interface Pitch:1.27mm Return loss(GSG):-14.01dB@14.23GHz Insertion loss(GSG):-1.0dB@14.23GHz Self inductance:0.95nH Ca

 Open the catalog to page 1
Manual test socket Image Sensor Sockets-2

www.connect.co.jp www.jccherry.com Clamshell type For manual product evaluation and mass-production with handler For various evaluation and mounting production Thru Hole Solder Dip Socket pin Solder Dip type

 Open the catalog to page 2

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*Prices are pre-tax. They exclude delivery charges and customs duties and do not include additional charges for installation or activation options. Prices are indicative only and may vary by country, with changes to the cost of raw materials and exchange rates.