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LD200-xP-NZP100-GG
LD200-xP-NZP100-GG
- Dielectric Strength: AC500Vrms for 1 minute
- Insulation Resistance: Minimum 500MΩ
- Contact Resistance: Maximum 15mΩ
- Current Rating: 2A
- Operating Temperature: -45℃ to +150℃
Material:
- Sleeve: Brass with Au plating over Ni
- Contact: Copper Alloy with Au plating over Ni
- Insulator: PPS or LCP Black
Design and Layout:
- The document provides detailed PC board layout specifications, including hole diameters and pitch circle diameters (P.C.D) for various components.
- Acceptable lead diameter ranges from φ0.48 to φ0.42 (0.0189" to 0.0165").
Product Variants:
- Multiple product numbers (P/N) are listed with specific remarks indicating low force types and other characteristics.
- Variants include LD200-3P and LD200-4P models with different specifications and force types.
Additional Notes:
- The document includes references to empty and through holes, indicating specific design requirements for PC board layouts.
- The layout details are crucial for ensuring compatibility with laser diode sockets and other components.
Catalog excerpts
www.connect.co.jp www.jccherry.com Laser Diode Socket Round Socket pin type Specifications Dielectric Strength : Insulation Resistance: Contact Resistance : Current Rating : Operating Temperature: Material Sleeve : Brass,Au plating over Ni Contact : Copper Alloy, Au plating over Ni Insulator : PPS or LCP Black LD200-3P-34 LD200-3P-29 NZNV80010-GG /Low force type LD200-3P-34-NV8 NZTNV810-GG /Low force type LD200-3P-29-NV8 Empty hole Through hole Through hole Empty hole Empty hole
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