www.connect.co.jp www.jccherry.com TO Package Test socket, Stamping contact type GU16 series Size16x27.9mm / 0.63x1.10" Specifications Contact resistance Current rating Withstanding Voltage Insulation Resistance Operating temperature TO-263/D2-PAK Burn-in Test Kelvin Contact(option) Cost competitive 50mΩ max 1.5A(Between Drain and Source)* DC500Vrms 1min 500MΩmin at DC500V -40 to +175℃ * Please contact us for the high current type. TO-263/D2-PAK Package Test Socket How to order S1045X103 : Device Guide Size, 10.3x10.45mm L1090X103 : Device Guide Size, 10.3x10.9mm N : No Kelvin Contact K : With Kelvin Contact D : Drain G : Gate S : Source ●Actual Size(Small Device type) Socket Outline KG,KD,KS Thru holes are for Kelvin contact. These holes are not necessary if Kelvin Contact is not required. PC Board Layout(Top View) ●Acceptable Device Table Typical Dimension

TO-263/D2-PAK Burn-in Test Kelvin Contact (option) Cost competitive TO Package Test socket, Stamping contact type GU16 series Size16x27. 9mm / 0. 63x1.10"•Actual Size(Large Device type) (27. 9) GK,DK,SK Thru holes are for Kelvin contact. These holes are not necessary if Kelvin Contact is not required. • Acceptable Device Table Typical Dimension Generally,TO-263/D2-PAK package size is specified. However, the size depends on the semiconductor manufacturers and devices. If you send us your device in advance,we can properly confirm its adoption.