www.connect.co.jp www.jccherry.com TO Package Test socket, Stamping contact type GU12 series Size12x24.9mm / 0.47x0.98" Specifications Contact resistance Current rating ・Withstanding Voltage Insulation Resistance Operating temperature TO-252/D-PAK Burn-in Test Kelvin Contact(option) Cost competitive * Please contact us for the high current type. TO-252/D-PAK Package Test Socket How to order Device Guide Size TO-252/D-PAK N : No Kelvin Contact K : With Kelvin Contact D : Drain G : Gate S : Source 15.5 13.5 ●Actual Size Stand off 6-φ0.55±0.05 Through hole PC Board Layout(Top View) GK,DK,SK Through holes are for Kelvin contact. These holes are not necessary if Kelvin Contact is not required. Socket Outline ●Acceptable device(Example) Typical dimension Generally,TO-252/D-PAK package size is specified. However, the size depends on the semiconductor manufacturers and devices. If you send us your device in advance,we can properly confirm its adoption.

www.connect.co.jp www.jccherry.com TO Package Test socket, Stamping contact type GU12 series Size12x24.9mm / 0.47x0.98" Infineon IPB180N04S4-H0 Alpha & Omega Semiconductor AOD1N60 Diodes Incorporated Although the device is listed, but it may not be compatible due to the large tolerance of the device dimension. Therfore, please send the sample of the device in advance and we will check the compatibility.