www.connect.co.jp www.jccherry.com TO Package Test Socket, GD26 series Size26x38.9mm / 1.024x1.531" QDPAK Burn-in Test Kelvin Contact (Option) Current Rating 12A Specifications Contact Resistance Current Rating : 50mΩ max : 12A at 25°C (Between Drain and Source) * Room temperature with 30°C T-Rise Withstanding Voltage : DC2000V 1min at 25°C Insulation Resistance : 500MΩmin at DC500V Operating Temperature : -40 to +200°C ** * Please contact us for the high current type. ** Including temperature rise due to electrical current. QDPAK Package Test Socket Acceptable Device GD26 - QDPAK - □ - S151X155 Device Guide size 15.1x15.5mm QDPAK Package N : No Kelvin Contact K : With Kelvin Contact : Drain : Gate : Driver Source : Power Source Terminal Pattern *** *** Also possible to support other terminal patterns. Please contact us for more details. Socket outline 4-φ1.6 Through Hole 6-φ0.7 Through Hole PC Board Layout (Top View) Tolerance:±0.05 Stand-off area DK : (Drain Kelvin) PS : (Power Source) PSK : (Power Source Kelvin) DS : (Driver Source) DSK : (Driver Source Kelvin) GK : (Gate Kelvin)

•Acceptable Device Table(Typical) Device dimensions vary depending on the semiconductor manufacturer and product. If you send us your device in advance,we can properly confirm its adoption.

www.connect.co.jp www.jccherry.com ● Examples of sockets acceptable with various packages These are examples of custom or semi-custom design sockets. Acceptable Test Socket Examples