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  3. GD25-HU3PAK-x-S141X142
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GD25-HU3PAK-x-S141X142
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GD25-HU3PAK-x-S141X142

GD25-HU3PAK-x-S141X142
1 /1Page

Catalog excerpts

GD25-HU3PAK-x-S141X142-1

www.connect.co.jp www.jccherry.com TO Package Test Socket,GD21 series Size21x37.2mm / 0.827"x 1.465" HU3PAK Burn-in Test Kelvin Contact (Option) Current Rating 12A Specifications Contact Resistance Current Rating : 50mΩ max : 12A at 25°C (Between Drain and Source) * Room temperature with 30°C T-Rise Withstanding Voltage : DC2000V 1min at 25°C Insulation Resistance : 500MΩmin at DC500V Operating Temperature : -40 to +200°C ** * Please contact us for the high current type. ** Including temperature rise due to electrical current. HU3PAK Package Test Socket Acceptable Device GD21 - HU3PAK - □ -S141X142 - FL Device Guide size 14.1x14.2mm HU3PAK Package N : No Kelvin Contact K : With Kelvin Contact FL : With Flange NFL : Without Flange : Drain : Gate : Driver Source : Source Terminal Pattern *** *** Also possible to support other terminal patterns. Please contact us for more details. Through Hole 2-φ2.2 M2 Screw Through Hole PC Board Layout(Top View) Tolerance:±0.05 Stand-off area DK : (Drain Kelvin) SK : (Source Kelvin) GK : (Gate Kelvin) The molded product has holes, so it is also compatible with the Kelvin contac

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*Prices are pre-tax. They exclude delivery charges and customs duties and do not include additional charges for installation or activation options. Prices are indicative only and may vary by country, with changes to the cost of raw materials and exchange rates.