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GD25-HU3PAK-x-S141X142

GD25-HU3PAK-x-S141X142
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GD25-HU3PAK-x-S141X142

Product catalog summary
Overview: The document provides technical specifications and ordering information for the GD21 series TO Package Test Socket, specifically the HU3PAK model. It includes details on size, current rating, temperature tolerance, and contact options.
Specifications:
  • Contact Resistance: Maximum of 50mΩ.
  • Current Rating: 12A at 25°C, applicable between Drain and Source with a 30°C temperature rise.
  • Withstanding Voltage: DC2000V for 1 minute at 25°C.
  • Insulation Resistance: Minimum of 500MΩ at DC500V.
  • Operating Temperature: Ranges from -40°C to +200°C, including temperature rise due to electrical current.
Ordering Information: The HU3PAK package test socket can be ordered with or without Kelvin contact. Options include:
  • N: No Kelvin Contact
  • K: With Kelvin Contact
  • FL: With Flange
  • NFL: Without Flange
Device Compatibility: The socket is compatible with devices having a terminal pattern of 14.1x14.2mm. It supports various terminal patterns, and customization is available upon request.
Design Features: The molded product includes holes for compatibility with Kelvin contact types. The socket design includes through holes and specific terminal designations such as Drain (D), Gate (G), Driver Source (DS), and Source (S).
See more

Catalog excerpts

GD25-HU3PAK-x-S141X142-1

www.connect.co.jp www.jccherry.com TO Package Test Socket,GD21 series Size21x37.2mm / 0.827"x 1.465" HU3PAK Burn-in Test Kelvin Contact (Option) Current Rating 12A Specifications Contact Resistance Current Rating : 50mΩ max : 12A at 25°C (Between Drain and Source) * Room temperature with 30°C T-Rise Withstanding Voltage : DC2000V 1min at 25°C Insulation Resistance : 500MΩmin at DC500V Operating Temperature : -40 to +200°C ** * Please contact us for the high current type. ** Including temperature rise due to electrical current. HU3PAK Package Test Socket Acceptable Device GD21 - HU3PAK - □ -S141X142 - FL Device Guide size 14.1x14.2mm HU3PAK Package N : No Kelvin Contact K : With Kelvin Contact FL : With Flange NFL : Without Flange : Drain : Gate : Driver Source : Source Terminal Pattern *** *** Also possible to support other terminal patterns. Please contact us for more details. Through Hole 2-φ2.2 M2 Screw Through Hole PC Board Layout(Top View) Tolerance:±0.05 Stand-off area DK : (Drain Kelvin) SK : (Source Kelvin) GK : (Gate Kelvin) The molded product has holes, so it is also compatible with the Kelvin contac

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