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GD21-HU3PAK-K-TEKB
GD21-HU3PAK-K-TEKB
Two test socket part numbers are provided for ordering: GD18-TO263-7-K-109-TEKB and GD21-HU3PAK-K-TEKB. Each corresponds to specific test socket configurations and evaluation test board sets.
Specifications
- Current Rating: DC12A at 25°C (Between Drain and Source)
- Insulation Resistance: Minimum 500MΩ
- Withstanding Voltage: AC2000Vrms for 1 minute at 25°C (Between Drain and Source)
- Operating Temperature: -55 to +175°C
- Note: Wires with crimp terminals are not included and must be prepared separately.
Test Socket and Evaluation Board Details
- For TO-263-7/D2-PAK and HU3PAK configurations.
- PC board size is 70mm x 70mm with a thickness of 1.6mm.
- Kelvin measurements are supported with GK, DK, SK terminals.
Additional Information
- Drain (D), Gate (G), and Source (S) are specified for both configurations.
- Driver Source (DS) is also mentioned for specific measurements.
Catalog excerpts
www.connect.co.jp www.jccherry.com Power Transistor Test Sockets + Evaluation Test Board Set Specifications Current Rating : DC12A at 25°C (Between Drain and Source) Insulaion Resistance : 500MΩ min. Withstanding Voltage : AC2000Vrms 1 minute at 25°C (Between Drain and Source) Operating Temperature : -55 to +175°C 〇 Wires with crimp terminals are not included. Please prepare them yourself. D : Drain G : Gate S : Source DS : Driver Source D : Drain G : Gate S : Source GK、DK、SKはケルビン測定用です。 GK, DK, SK are for Kelvin measurements. Test socket P/N : GD18-TO263-7-K-109 PC board size : 70mm x 70mm PC board thickness : 1.6mm Test socket P/N : GD21-HU3PAK-K-S141X142 PC board size : 70mm x
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