G6A-8P-JDL588

G6A-8P-JDL588

Product catalog summary
Relay Sockets Overview
This document provides technical specifications and guidelines for relay sockets, specifically models G6A-8P-JDL588 and G6AK-10P-JDL588. The sockets are designed with specific pin configurations and spacing requirements.

Specifications
  • Pin Configuration: G6A-8P-JDL588 has 8 pins, while G6AK-10P-JDL588 has 10 pins.
  • Row Spacing: 7.62mm (0.300 inches) between rows.
  • Dimensions: Various dimensions are provided for pin positions and board layout, including 20.2mm (0.80 inches) and 17.78mm (0.70 inches).
  • Material: Epoxy glass is used for pin positioning.

PC Board Layout
  • Top view layouts are provided with specific measurements for hole sizes and pin positions.
  • PC board hole size is specified as φ1.1±0.05mm (φ0.043"±0.002").

Compatible Relays
  • Compatible with OMRON relay models such as G6AK-274P, G6AK-274P-ST-US, G6A-274P, G6A-274P-ST-US, and G6AU-274P.

Usage Recommendations
  • Ensure the insulator and PC board are not too close to prevent solder wicking to the contact area.
  • Mount below the necked part of the socket pin for optimal performance.

Additional Information
  • For more details, visit the websites: www.connect.co.jp and www.jccherry.com.
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Catalog excerpts

G6A-8P-JDL588-1

www.connect.co.jp www.jccherry.com Epoxy Glass Compatible relays P/N Epoxy Glass PC Board Layout (Top View) PC Board Layout (Top View) (OMRON) Compatible relays P/N G6AK-274P-□□ G6AK-274P-ST□□-US(OMRON) 7.62mm/0.300" Spacing between Rows Relay Sockets Spacing between Rows 7.62mm/0.300" PC Board Hole Size (Reference) φ1.1±0.05/φ0.043"±0.002" Lead pin not the same Circumferental direction * If the insulator and the PC Board are too close, there is a risk of solder wicking up to the contact area. Please mo

 Open the catalog to page 1

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*Prices are pre-tax. They exclude delivery charges and customs duties and do not include additional charges for installation or activation options. Prices are indicative only and may vary by country, with changes to the cost of raw materials and exchange rates.