www.connect.co.jp www.jccherry.com Test & Burn-In Socket, GU22HT molded frame series Size22x22mm / 0.87x0.87" 0.5mm pitch 14x14 contact max High Temperature 175℃ Pitch Acceptable package Acceptable device size * Please contact us for larger sizes. * If you require a different pitch, please contact us. Features: ● Contact parts use reliable high-heat-resistant probe pins ● Compatible with high frequencies ● Superior in thermal environments ● Able to accommodate short delivery times Specification(Typical) Current Rating Contact Resistance Dielectric Strength Voltage Insulation Resistance Temperature Range Conatct configuration Device Actual size φ0.3 min/0.012" Note） ( Au Pad ) ･The pad structure should be Non-Solder Mask Defined. ･Silkscreen should not be in the socket installation area. ･When designing with Via-in-Pad, fill the holes in via and make sure there is no unevenness on the pad surface. ･The pad should be same or heigher than Solder mask.

www.connect.co.jp www.jccherry.com Parts number: example) Device pattern (Bottom View) Device thickness ○We accept IC device foot pattern and thickness other than on this. Should you have any questions or concerns regarding this matter, please feel free to contact us

www.connect.co.jp www.jccherry.com ●For QFN Parts number: example) Device pattern (Bottom View) Code Device thickness ○We accept IC device foot pattern and thickness other than these. If you have any questions or concerns regarding this matter, please feel free to contact us.