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JC CHERRY INC.
Burn-in test socket GU22 Series

Burn-in test socket GU22 Series

Product catalog summary

Overview: This document provides technical specifications and ordering information for the Test & Burn-In Socket, GU22HT molded frame series, designed for BGA and QFN packages. It includes details on device compatibility, features, specifications, and ordering codes.

Specifications:

Size: 22x22mm / 0.87x0.87"
Pitch: 0.5mm/0.020" (14x14 contact max)
Acceptable Package: BGA/QFN (LGA)
Acceptable Device Size: max 7mm/0.28"
Current Rating: 1.0A at 25℃
Contact Resistance: 100mΩ max
Dielectric Strength Voltage: AC100V rms 1 min
Insulation Resistance: 1000MΩ min at DC100V
Temperature Range: -40 to +175℃

Features:

High-heat-resistant probe pins
Compatible with high frequencies
Superior performance in thermal environments
Short delivery times

PC Board Layout: The document provides a top view layout with specific measurements for contact configuration and screw placements. It emphasizes the importance of a non-solder mask defined pad structure and the absence of silkscreen in the socket installation area.

Ordering Information: The document includes tables for device patterns and thicknesses, with specific codes for ordering. It provides examples of part numbers and instructions on how to order based on device pattern and thickness.

Notes: The document advises contacting the company for larger sizes or different pitches and provides contact information for inquiries about IC device foot patterns and thicknesses not listed.

Catalog excerpts

www.connect.co.jp www.jccherry.com Test & Burn-In Socket, GU22HT molded frame series Size22x22mm / 0.87x0.87" 0.5mm pitch 14x14 contact max High Temperature 175℃ Pitch Acceptable package Acceptable device size * Please contact us for larger sizes. * If you require a different pitch, please contact us. Features: ● Contact parts use reliable high-heat-resistant probe pins ● Compatible with high frequencies ● Superior in thermal environments ● Able to accommodate short delivery times Specification(Typical) Current Rating Contact Resistance Dielectric Strength Voltage Insulation Resistance Temperature Range Conatct configuration Device Actual size φ0.3 min/0.012" Note） ( Au Pad ) ･The pad structure should be Non-Solder Mask Defined. ･Silkscreen should not be in the socket installation area. ･When designing with Via-in-Pad, fill the holes in via and make sure there is no unevenness on the pad surface. ･The pad should be same or heigher than Solder mask.

Open the catalog to page 1

www.connect.co.jp www.jccherry.com Parts number: example) Device pattern (Bottom View) Device thickness ○We accept IC device foot pattern and thickness other than on this. Should you have any questions or concerns regarding this matter, please feel free to contact us

Open the catalog to page 2

www.connect.co.jp www.jccherry.com ●For QFN Parts number: example) Device pattern (Bottom View) Code Device thickness ○We accept IC device foot pattern and thickness other than these. If you have any questions or concerns regarding this matter, please feel free to contact us.

Open the catalog to page 3

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*Prices are pre-tax. They exclude delivery charges and customs duties and do not include additional charges for installation or activation options. Prices are indicative only and may vary by country, with changes to the cost of raw materials and exchange rates.

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