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Burn-in test socket GQ29-BGA Series

Burn-in test socket GQ29-BGA Series
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Burn-in test socket GQ29-BGA Series

Product catalog summary
Overview: The document provides technical specifications and ordering information for the GQ29 molded frame series of test and burn-in sockets, suitable for QFN and BGA devices. The sockets are designed for high reliability, cost competitiveness, and short delivery times, with an operational temperature range of -40℃ to +150℃.
Specifications:
  • Size: 29x30.6mm (1.14"x1.20")
  • Acceptable device size: Max □13mm/0.51" for QFN; specific dimensions for BGA devices are provided.
  • Temperature range: -40℃ to +150℃ (typical)
Ordering Information:
  • For QFN devices, use the format GQ29-QFN□□□□□□□.
  • For BGA devices, use the format GQ29-BGA□□□□□□□.
  • Part numbers will be provided after specifications are finalized.
Design Features:
  • High reliability and cost-effective design.
  • Short delivery time.
  • Specific PCB patterns and through-hole dimensions are provided for both QFN and BGA devices.
Additional Details:
  • Includes diagrams with dimensions for PCB patterns and socket layouts.
  • Instructions for ordering and customization options are available.
See more

Catalog excerpts

Burn-in test socket GQ29-BGA Series-1

www.connect.co.jp www.jccherry.com Test & Burn-In Socket, GQ29 molded frame series Size29x30.6mm / 1.14"x1.20" Acceptable device size In the case of larger size, consult factory. Any device on 0.30mm pitch or larger Features: ●High reliability ●Cost competitive ●Short delivery time ●Temperature -40℃ to +150℃ (typical) P/N will be informed after fixing specifications. actual size Through hole Stand off Area PCB Pattern(Top View)

 Open the catalog to page 1
Burn-in test socket GQ29-BGA Series-2

www.connect.co.jp www.jccherry.com Features: ●High reliability ●Cost competitive ●Short delivery time ●Temperature -40℃ to +150℃ (typical) P/N will be informed after fixing specifications.

 Open the catalog to page 2

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