
www.connect.co.jp www.jccherry.com Test & Burn-In Socket, GU41 molded frame series Size40x50.25mm / 1.57x1.98" Acceptable device : BGA(FPGA), LGA ,etc. Temperature Range(typical): -40℃~+150℃ Acceptable device size Features : ・High reliability ・Cost competitive ・Short delivery time 0.8/0.031" 22x22 contact Max. In the case of larger size, consult factory. Acceptable Device example t=2.2 Max. Device type Device thickness:t(mm) Please refer to the list on the next page for the device type and thickness. Actual size * Recommended PC Board thickness t=1.6
Open the catalog to page 1www.connect.co.jp www.jccherry.com Socket part number/Acceptable device type(For BGA/FPGA) ・For LGA, we manufacture sockets with custom designs to accept your device. ・We accept IC device foot pattern and thickness other than on this. Should you have any questions or concerns regarding this matter, please fee
Open the catalog to page 21 Page
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