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BGA socket GU41 series

BGA socket GU41 series

BGA socket GU41 series

Product catalog summary
Overview: This document provides technical specifications and details for the Test & Burn-In Socket, specifically the GU41 molded frame series. It includes information on dimensions, features, and compatible devices.
Specifications:
  • Socket Size: 40x50.25mm (1.57x1.98 inches)
  • Maximum Contact: 22x22
  • Temperature Range: -40℃ to +150℃
  • Recommended PC Board Thickness: 1.6mm
  • Pitch: 0.8mm
Features:
  • High reliability
  • Cost competitive
  • Short delivery time
Compatible Devices:
  • Acceptable device types include BGA (FPGA), LGA, etc.
  • Specific device examples: GU41-08B484-T220P/N
  • Device thickness varies; consult factory for larger sizes
Device Compatibility:
  • 256-Pin UBGA (Intel): 0.8mm pitch, 256pin (16x16)
  • 169-Pin UBGA (Intel): 169pin (13x13)
  • 484-Pin UBGA (Intel): 484pin (22x22)
  • SF363/SFG363 (Xilinx): 363pin (20x20)
  • CS280/CSG280 (Xilinx): 280pin (19x19)
  • CS144/CSG144 (Xilinx): 144pin (13x13)
  • CS484/CSG484 (Xilinx): 484pin (22x22)
  • CS324/CSG324 (Xilinx): 324pin (18x18)
Custom Solutions:
  • Custom socket designs are available for LGA devices.
  • IC device foot patterns and thicknesses other than those listed can be accommodated.
Contact Information: For further inquiries or custom requirements, contact the manufacturer.
See more

Catalog excerpts

BGA socket GU41 series-1

www.connect.co.jp www.jccherry.com Test & Burn-In Socket, GU41 molded frame series Size40x50.25mm / 1.57x1.98" Acceptable device : BGA(FPGA), LGA ,etc. Temperature Range(typical): -40℃~+150℃ Acceptable device size Features : ・High reliability ・Cost competitive ・Short delivery time 0.8/0.031" 22x22 contact Max. In the case of larger size, consult factory. Acceptable Device example t=2.2 Max. Device type Device thickness:t(mm) Please refer to the list on the next page for the device type and thickness. Actual size * Recommended PC Board thickness t=1.6

 Open the catalog to page 1
BGA socket GU41 series-2

www.connect.co.jp www.jccherry.com Socket part number/Acceptable device type(For BGA/FPGA) ・For LGA, we manufacture sockets with custom designs to accept your device. ・We accept IC device foot pattern and thickness other than on this. Should you have any questions or concerns regarding this matter, please fee

 Open the catalog to page 2

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  25. UJRK60-2x

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  29. PDSP series

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  30. PDSP-

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  32. T4P-L214-ST-

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  36. PDHS254-

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  37. PDSA-

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  38. T

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*Prices are pre-tax. They exclude delivery charges and customs duties and do not include additional charges for installation or activation options. Prices are indicative only and may vary by country, with changes to the cost of raw materials and exchange rates.