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BGA socket GU41 series

BGA socket GU41 series

BGA socket GU41 series

Product catalog summary
Overview: The document provides technical specifications and details for the GU41 molded frame series Test & Burn-In Socket, specifically the GU41-10B256-T140 model. It is designed for use with BGA (FPGA), LGA, and other similar devices.
Specifications:
  • Socket Size: 40x50.25mm (1.57x1.98 inches). For larger sizes, consultation with the factory is recommended.
  • Acceptable Device Size: Up to 18x18 contacts maximum.
  • Temperature Range: -40°C to +150°C.
  • PC Board Layout: Includes detailed measurements for through holes and pin configurations.
Features:
  • High reliability.
  • Cost-effective.
  • Short delivery time.
Device Compatibility:
  • Compatible with BGA (FPGA), LGA, and other devices.
  • Custom designs available for LGA devices to match specific customer requirements.
  • Supports various device types and thicknesses, with a reference list provided for specific models like Xilinx and Intel.
Recommendations:
  • For devices not listed, custom solutions are available upon request.
  • Recommended PC Board thickness is 1.6mm for M2 screws and guide pins.
Additional Information: The document includes detailed diagrams and measurements for socket and device compatibility, emphasizing the importance of consulting for custom designs and unlisted device patterns.
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Catalog excerpts

BGA socket GU41 series-1

Test & Burn-In Socket, GU41 molded frame series Size40x50.25mm / 1.57x1.98" 適合デバイス Acceptable device : BGA(FPGA), LGA ,etc. 使用温度範囲 Temperature Range(typical): -40℃~+150℃ 適合デバイスサイズ Acceptable device size High reliability Cost competitive Short delivery time 特徴 Features : ・高信頼性 ・低コスト ・短納期対応可能 1.0/0.039" 18x18 contact Max. In the case of larger size, consult factory. ソルダーディップタイプ(例) Solder Dip type(Example) P/N 適合デバイス例 Acceptable Device example t=1.4 Max. GU41 - 10B256 - T140 デバイスタイプ Device type * Recommended PC Board thickness t=1.6 デバイス厚み Device thickness:t(mm)

 Open the catalog to page 1
BGA socket GU41 series-2

ソケット品番/適合デバイスタイプ(For BGA/FPGA) Socket part number/Acceptable device type(For BGA/FPGA) Socket P/N t=1.46~1.55 0.4 ・LGAの場合は、お客様のご使用のデバイスに合わせてカスタム設計いたします。 ・ここに記載のないデバイスのパターン、厚みにも対応可能です。別途お問い合わせください。 ・For LGA, we manufa

 Open the catalog to page 2

All JC CHERRY INC. catalogs and technical brochures

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  21. LD200-4P-xx

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  22. LD200P-xP-F8

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  23. LD143-xP-H85

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  24. TT3P-L214

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  25. UJRK60-2x

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  26. HAYC-x-2P-15

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  27. MPGAP Series

    2  Pages

  28. GU10 Series

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  29. PDSP series

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  30. PDSP-

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  31. PDSP

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  32. T4P-L214-ST-

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  33. LD143-4P-H85

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  34. LD254-3P-

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  35. LD200P-3P-F8

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  36. PDHS254-

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  37. PDSA-

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  38. T

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Archived catalogs

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*Prices are pre-tax. They exclude delivery charges and customs duties and do not include additional charges for installation or activation options. Prices are indicative only and may vary by country, with changes to the cost of raw materials and exchange rates.