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  3. BGA socket GU41 series

BGA socket GU41 series
1 /2Pages

BGA socket GU41 series

BGA socket GU41 series
1 /2Pages

Catalog excerpts

BGA socket GU41 series-1

Test & Burn-In Socket, GU41 molded frame series Size40x50.25mm / 1.57x1.98" 適合デバイス Acceptable device : BGA(FPGA), LGA ,etc. 使用温度範囲 Temperature Range(typical): -40℃~+150℃ 適合デバイスサイズ Acceptable device size High reliability Cost competitive Short delivery time 特徴 Features : ・高信頼性 ・低コスト ・短納期対応可能 1.0/0.039" 18x18 contact Max. In the case of larger size, consult factory. ソルダーディップタイプ(例) Solder Dip type(Example) P/N 適合デバイス例 Acceptable Device example t=1.4 Max. GU41 - 10B256 - T140 デバイスタイプ Device type * Recommended PC Board thickness t=1.6 デバイス厚み Device thickness:t(mm)

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BGA socket GU41 series-2

ソケット品番/適合デバイスタイプ(For BGA/FPGA) Socket part number/Acceptable device type(For BGA/FPGA) Socket P/N t=1.46~1.55 0.4 ・LGAの場合は、お客様のご使用のデバイスに合わせてカスタム設計いたします。 ・ここに記載のないデバイスのパターン、厚みにも対応可能です。別途お問い合わせください。 ・For LGA, we manufa

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All JC CHERRY INC. catalogs and technical brochures

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  2. D2RF-PLUG-L

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  4. SHVR-T16P

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  5. FSE1A-5P

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  6. UJMSF Series

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  7. UJMSW Series

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  8. UJMST Series

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  15. MDSxxP-ST-x

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  16. MDSxxP-SC-x

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  17. MDSxxR-SC-x

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  18. RPSMAJ103-T

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  21. LD200-4P-xx

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  22. LD200P-xP-F8

    1  Page

  23. LD143-xP-H85

    1  Page

  24. TT3P-L214

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  25. UJRK60-2x

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  26. HAYC-x-2P-15

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  27. MPGAP Series

    2  Pages

  28. GU10 Series

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  29. PDSP series

    1  Page

  30. PDSP-

    1  Page

  31. PDSP

    1  Page

  32. T4P-L214-ST-

    1  Page

  33. LD143-4P-H85

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  34. LD254-3P-

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  35. LD200P-3P-F8

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  36. PDHS254-

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  37. PDSA-

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  38. T

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  39. GD18 series

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  40. GU16 series

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Archived catalogs

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  2. T3P

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*Prices are pre-tax. They exclude delivery charges and customs duties and do not include additional charges for installation or activation options. Prices are indicative only and may vary by country, with changes to the cost of raw materials and exchange rates.