Surface Mount Power Device(SMPD) and Mini SMPD Packages
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Surface Mount Power Device(SMPD) and Mini SMPD Packages Lighter weight, more power(ultra-low prole, energy ecient, and rugged) SMPD OVERVIEW IXYS introduces a new packaging technology – the Surface Mount Power Device (SMPD) package. It is an expansion of the ISOPLUS™ package portfolio, which has been providing isolated-package solutions to the power electronics industry for more than a decade. Compared to copper-based lead-frame packages, these devices exhibit better thermal performance, lower weight, and better power cycling capability. D The SMPD package can be easily surface-mounted on a Printed Circuit Board (PCB) using a standard pick-and-place and reow soldering process. No costly screws, cables, bus-bars or hand soldered contacts are needed. Weighing only 8g, it is much lighter (typically by 50%) than comparable conventional power modules, thereby enabling lower weight power systems for IXYS customers. This is one of the key “Green” initiatives of IXYS Corporation in developing new products for the Cleantech industry that are lighter in weight. Moreover, due to its compact and ultra-low prole package, it is possible to use the same heat sink for multiple devices, saving PCB space. Another added benet of being smaller and lighter is that it provides a better protection against vibrations and g-forces, especially if used in portable appliances, increasing the life expectancy and reliability of these devices. IXYS is virtually the rst power semiconductor company to oer surface-mountable high-voltage Power MOSFETs and IGBTs. A ceramic isolation of up to 4.5kV is achieved with the Direct Copper Bond (DCB) substrate technology – an electrically isolated tab is provided for heat sinking. The DCB provides low thermal impedance and best-in-class power and temperature cycling capabilities. The ISOPLUS™ advantage also facilitates having multiple die on the same single substrate – buck, boost, phase-leg, full-bridge, half-bridge congurations are implementable. “This unique device is part of our initiative of taking power systems on a diet, literally, with the aim of reducing the weight of the power semiconductors in a typical power system. Weight reduction is a key eort in reducing greenhouse gas emissions in the production, shipment and use of power products,” commented Dr. Nathan Zommer, Founder and CEO of IXYS Corporation, regarding the recently released 1kV/30A Q3 HiperFET™ Power MOSFET in the SMPD package. “Our lighter products use less material, require less energy to ship, and result in lower weight products for our customers, a critical desired feature in a lot of applications, including portable equipment, and for the automotive and transportation industry.” The new surface-mountable SMPD package is an ideal replacement part for bulky traditional power modules. IXYS is able to oer various SMPD topologies – the MMIX1F44N100Q3 is a single die 1000V/30A HiperFET™ Power MOSFET, the IXA68PF650LB a 1200V/68A dual IGBT with anti-parallel diodes, the DMA90U1800LB a 1800V/99A three phase rectier diode. Upon request, IXYS can manufacture other customer-specic congurations. SMPD ADVANTAGES Ultra-low and compact package prole (5.3mm height x 24.8mm length x 32.3mm width) Surface mountable via standard reow process (Available in Tape & Reel packaging) Low package weight (8g) Up to 4500V ceramic isolation(DCB) Low package inductance Excellent thermal performance High power cycling capability CONFIGURATIONS Buck Boost Full-bridge Half-bridge Phase leg Single APPLICATIONS DC-DC converters Battery chargers Switching and resonant power supplies DC choppers Temperature and lighting controls Motor drives E-bikes and electric and hybrid vehicles Solar inverters Induction heaters

Ultra-low profile SMPD package The above accentuates the compact and low profile nature of the device. Compared to a conventional high power package such as the SOT-227, the IXYS SMPD features % the weight and 1/3 the volume and provides similar electrical and thermal characteristics. Direct Copper Bond (DCB) isolation __ • Provides up to 4B00V ceramic isolation cycling capabilities SMPD Package Outlines Heat Sink Mounting Guidelines Figure 1: SMPD heat sink assembly The following points should be considered when attaching a heat sink to the package to ensure a good thermal contact between...

SMPD Power MOSFETs Summary Table Part Number Package Style GigaMOSTM TrenchTM HiperFETTM MMIX1F420N10T Under development Under development SMPD IGBT Summary Table VCES (V) Package style Copacked (FRED) Copacked (FRED) Copacked (FRED) Copacked (FRED) Copacked (FRED) under development under development under development under development under development Part Number

Mini SMPD Overview To help make even lighter, more efficient, and compact power conversion systems possible, IXYS offers a smaller version of the SMPD package - the Mini SMPD, which is illustrated in Figure 2 below. Just like in the SMPD, an electrical isolation of 4B00V between the semiconductor chip and base copper is achieved with the Direct Copper Bond (DCB) technology, which is a well-known techniquefor high-voltage isolation and provides excellentthermal conductivity and high-current carrying capability. The structure consists of three layers (Copper, Alumina substrate, and Copper);...