Introduction
The demand for power semiconductors in automotive applications has significantly increased over the past five years. While discrete devices are commonly used, higher power applications require more robust and reliable systems that cannot be achieved by simply paralleling discrete components.

Challenges in Power Systems
Key challenges include large die sizes, mismatched temperature expansion coefficients between silicon and copper lead frames, high ambient temperatures (up to 120°C), and the need for high packaging density, compactness, low power dissipation, and good heat transfer characteristics.

IXYS Solutions
IXYS addresses these challenges with its proprietary ISOPLUS™ packaging technology. The technology uses DCB or DAB ceramic substrates to hold up to 20 Trench-MOSFETs or combinations with Schottky diodes for Boost or Buck applications. The DAB substrate offers higher reliability under repetitive temperature cycles.

Additional Products
IXYS also offers a range of Gate Driver ICs, such as the IXBD4410/11 and IX6R11 for phase-leg applications, and the IXDD402-430 series for low side gating, with output peak currents up to 30A.

Custom Solutions
IXYS Semiconductor GmbH, QS 9000 qualified, offers expertise in custom-specific power modules, including integration of driving and protection functions.

Contact Information
For more information, contact your authorized IXYS sales representative.