Overview

This document presents technical information about Invacu Ltd.'s vacuum reflow soldering systems, highlighting their features, capabilities, and applications.

Key Specifications and Features

• Vacuum Assisted Bonding Process: The systems utilize vacuum to ensure void-free attachment during soldering, improving joint quality.
• Programmable Vacuum Ovens: Equipped with both bottom and top heating elements, allowing precise temperature control.
• Individual Heater Control: Enables fine-tuning of temperature zones for optimal soldering profiles.
• Formic Acid Bubbler with Automatic Refill: Supports controlled atmosphere for soldering processes.
• High Temperature Accuracy and Independent Overheat Protection: Ensures process reliability and safety.
• Low Nitrogen Consumption: Designed for efficient gas usage during soldering.
• Heating Area and Temperature Range: XL heating area with maximum temperature up to 650 °C and maximum pressure of 4.5 bar.
• Size and Capacity: Supports product sizes up to 420 mm, suitable for single sample R&D to multi-batch production.

Process Advantages

• Vacuum-assisted bonding reduces voids and improves solder joint integrity compared to no vacuum processes.
• X-ray comparisons demonstrate superior quality of vacuum soldering.
• Wide variety of options available to tailor systems to specific production needs.

Applications and Product Range

The systems cater to a broad range of applications from research and development single samples to large-scale multi-batch production, supporting diverse product sizes and configurations.

Contact Information

Invacu Ltd.
Odrin 2 str., 8001 Burgas, Bulgaria
Tel./Fax: +359 56 813631
Email: [email protected]
Document printed: April 2019