Solderless SMT Card Edge Contact System An Interplex Press-Fit Product (Patent Pending) Interplex Industries presents a new SMT card edge connector system based on a discrete SMT component that creates a solderless press-fit edge card connector system for daughter card applications. The Interplex SMT Card Edge Contact System features Interplex-tested and proven 0.64mm press-fit technology Packaged in 16mm X 4mm pitch EIA tape for compatibility to standard high-speed pick and place equipment Strong through-hole SMD soldered interface for high mechanical strength High conductivity material for up to15 amps per contact Strong through-hole SMD solder interface Interplex-tested and proven press-fit solderless connection Recesses for improved SMT solder distribution and joint strength 3.2mm (.126”) Center Minimum PCB spacing Designed for standard 1.6mm (.062” ) thick PCB’s (Compatible with additional PCB thicknesses) . Industrial . Medical . Interplex Industries, Inc. 14-34 110 St., Suite 301 College Point, NY 11356 USA

SMT Card Edge Contact System (Patent Pending) Basic Specifications: • Maximum operating temperature: 125°C • Contact resistance: 1 mΩ max press-fit Interface • 30N minimum retention force per each press-fit contact • Packaging :16mm X 4mm pitch tape & reel on 13” diameter Reel • Reeled continuous metal stamping packaging option Dimensions: : See data sheet E-IPX15277 for full product outline and PCB specifications Application View Reel Packaging Basic Dimensions SMD Pocket Tape 13” Plastic Reel Continuous Stamped 15” Reel Sample kit it Includes: ( For qualified applications ) Parts in SMD pocket...