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- Solderless SMT Card Edge Contact System An Interplex Press-Fit Product
Solderless SMT Card Edge Contact System An Interplex Press-Fit Product
Solderless SMT Card Edge Contact System An Interplex Press-Fit Product
Interplex Industries introduces a new SMT card edge connector system designed for daughter card applications. This system is based on a discrete SMT component that enables a solderless press-fit edge card connector.
Features
- Utilizes Interplex's proven 0.64mm press-fit technology.
- Packaged in 16mm x 4mm pitch EIA tape, compatible with standard high-speed pick and place equipment.
- Strong through-hole SMD soldered interface for enhanced mechanical strength.
- High conductivity material supports up to 15 amps per contact.
Applications
The system is suitable for various sectors including automotive, industrial, medical, military, and telecom.
Specifications
- Maximum operating temperature: 125°C.
- Contact resistance: 1 mΩ max at the press-fit interface.
- Minimum retention force: 30N per press-fit contact.
- Packaging: 16mm x 4mm pitch tape & reel on a 13” diameter reel.
- Reeled continuous metal stamping packaging option available.
Design and Compatibility
- Features recesses for improved SMT solder distribution and joint strength.
- Minimum PCB spacing of 3.2mm (0.126”).
- Designed for standard 1.6mm (0.062”) thick PCBs, compatible with additional thicknesses.
Additional Information
For detailed product outline and PCB specifications, refer to data sheet E-IPX15277.
Sample Kit
Includes application view, basic dimensions, PCB layout, reel packaging, continuous stamped 15” reel, SMD pocket tape, and a demonstration PCB assembly.
Catalog excerpts
Solderless SMT Card Edge Contact System An Interplex Press-Fit Product (Patent Pending) Interplex Industries presents a new SMT card edge connector system based on a discrete SMT component that creates a solderless press-fit edge card connector system for daughter card applications. The Interplex SMT Card Edge Contact System features Interplex-tested and proven 0.64mm press-fit technology Packaged in 16mm X 4mm pitch EIA tape for compatibility to standard high-speed pick and place equipment Strong through-hole SMD soldered interface for high mechanical strength High conductivity material for up to15 amps per contact Strong through-hole SMD solder interface Interplex-tested and proven press-fit solderless connection Recesses for improved SMT solder distribution and joint strength 3.2mm (.126”) Center Minimum PCB spacing Designed for standard 1.6mm (.062” ) thick PCB’s (Compatible with additional PCB thicknesses) . Industrial . Medical . Interplex Industries, Inc. 14-34 110 St., Suite 301 College Point, NY 11356 USA
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SMT Card Edge Contact System (Patent Pending) Basic Specifications: • Maximum operating temperature: 125°C • Contact resistance: 1 mΩ max press-fit Interface • 30N minimum retention force per each press-fit contact • Packaging :16mm X 4mm pitch tape & reel on 13” diameter Reel • Reeled continuous metal stamping packaging option Dimensions: : See data sheet E-IPX15277 for full product outline and PCB specifications Application View Reel Packaging Basic Dimensions SMD Pocket Tape 13” Plastic Reel Continuous Stamped 15” Reel Sample kit it Includes: ( For qualified applications ) Parts in SMD pocket...
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