Overview: The document describes the Interplex CAP-LOC™ System, a solderless mounting system for
electrolytic capacitors designed to eliminate the need for soldering, adhesives, or clamps in making electrical and mechanical connections to PCBs. It is particularly suited for automotive and other mobility applications.
Key Features:- Completely solderless interconnection system.
- Utilizes 0.8mm press-fits for superior retention and electrical conductivity.
- Accommodates capacitor diameter and length tolerances.
- High force mechanical capacitor clamp made of low mass plastic.
- High normal force electrical connection to capacitor leads.
- Minimal stress relaxation on spring contact and minimal lead deformation or coating damage.
- No conductive components touch the capacitor body.
- 4-sided capture of capacitor leads, designed for 18mm diameter capacitor bodies.
- Easy assembly system with an open back design for visibility of polarity markings and length tolerance compliance.
Applications: The system is applicable in various sectors including powertrain control (engine & transmission, battery management, DC converters-inverters, cooling fans, water pumps), safety control (airbag controls, electronic braking, HID lamps), and convenience controls (AC/ventilation, small motor drives, electronic steering).
Performance Specifications:- Maximum operating temperature: 125 °C.
- Contact resistance: 1 mΩ max from capacitor lead to PCB.
- PCB retention force: 250N typical (Y-direction).
- Capacitor retention force: 125N typical (Z-direction).
- 3Kg normal force contact beam to capacitor leads.
Additional Information: For detailed dimensions and PCB footprint, refer to data sheet IPX15108. The system includes a single motion assembly fixture and PCB assembly tool, with a patent pending status.
See more