Mobile 3rd Gen Intel® Core? Processor Family: Datasheet, Vol. 1
172Pages

Mobile 3rd Generation Intel® Core™ Processor Family, Mobile Intel® Pentium® Processor Family, and Mobile Intel® Celeron® Processor Family Datasheet, Volume 1 of 2

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Revision History Revision Number 001 Revision Date • Initial release • Added Mobile 3rd Generation Intel® Core™ i7-3520M, i5-3360M, i5-3320M, i7-3667U, i5-3427U processors • Updated Table 7-10, Processor Graphics (VAXG) Supply DC Voltage and Current Specifications • Updated Section 1.5, Package 003 • Removed DDR 1066 MHz support • Updated Table 2-5, DDR3L/DDR3L-RS System Memory Timing Support • Added support for DDR3L-RS • Minor edits throughout for clarity 004 • Added Mobile 3rd Generation Intel® Core™ i7-3940XM, i7-3840QM, i73740QM processors • Removed references to the VCC_DIE_SENSE...

Introduction The Mobile 3rd Generation Intel® Core™ processor family, Mobile Intel® Pentium® processor family, and Mobile Intel® Celeron® processor family are the next generation of 64-bit, multi-core mobile processors built on 22-nanometer process technology. The processor is designed for a two-chip platform. The two-chip platform consists of a processor and a Platform Controller Hub (PCH) and enables higher performance, lower cost, easier validation, and improved x-y footprint. The processor includes Integrated Display Engine, Processor Graphics, and an Integrated Memory Controller. The...

Mobile Processor Platform Intel® Processor PECI Embedded Display Port Intel® Flexible Display Interface Intel® Management Engine Intel® 6/7 Series Chipset Families LVDS Flat Panel WiFi / WiMax Gigabit Network Connection Note: 1. USB 3.0 is supported on the Intel® 7 Series Chipset family only.

Processor Feature Details • • • • Four or two execution cores A 32-KB instruction and 32-KB data first-level cache (L1) for each core A 256-KB shared instruction / data second-level cache (L2) for each core Up to 8-MB shared instruction / data third-level cache (L3), shared among all cores Supported Technologies • Intel® Virtualization Technology (Intel® VT) for Directed I/O (Intel® VT-d) • Intel® Virtualization Technology (Intel® VT) for IA-32, Intel® 64 and Intel® Architecture (Intel® VT-x) Intel® Active Management Technology (Intel® AMT) 8.0 • Intel® Trusted Execution Technology (Intel®...

• Processor on-die Reference Voltage (VREF) generation for both DDR3 Read (RDVREF) and Write (VREFDQ) • 1Gb, 2Gb, and 4Gb DDR3 DRAM device technologies are supported — Using 4Gb DRAM device technologies, the largest memory capacity possible is 32 GB, assuming Dual Channel Mode with four x8 dual ranked DIMM memory configuration • Up to 64 simultaneous open pages, 32 per channel (assuming 8 ranks of 8 bank devices) • Command launch modes of 1N/2N • On-Die Termination (ODT) • Asynchronous ODT • Intel® Fast Memory Access (Intel® FMA): — Just-in-Time Command Scheduling — Command Overlap —...

• PCI Express* extended configuration space. The first 256 bytes of configuration space aliases directly to the PCI Compatibility configuration space. The remaining portion of the fixed 4-KB block of memory-mapped space above that (starting at 100h) is known as extended configuration space. • PCI Express* Enhanced Access Mechanism. Accessing the device configuration space in a flat memory mapped fashion. • Automatic discovery, negotiation, and training of link out of reset • Traditional AGP style traffic (asynchronous non-snooped, PCI-X Relaxed ordering) • Peer segment destination posted...

• 64-bit downstream address format; however, the processor never generates an address above 64 GB (Bits 63:36 will always be zeros) • 64-bit upstream address format, but the processor responds to upstream read transactions to addresses above 64 GB (addresses where any of Bits 63:36 are nonzero) with an Unsupported Request response. Upstream write transactions to addresses above 64 GB will be dropped. • Supports the following traffic types to or from the PCH: — DMI -> DRAM — DMI -> processor core (Virtual Legacy Wires (VLWs), Resetwarn, or MSIs only) — Processor core -> DMI • APIC and MSI...

Embedded DisplayPort* (eDP*) • Stand alone dedicated port (unlike two generations ago that shared pins with PCIe interface) Intel® Flexible Display Interface (Intel® FDI) • For SKUs with graphics, carries display traffic from the Processor Graphics in the processor to the legacy display connectors in the PCH • Based on DisplayPort standard • The two Intel FDI links are capable of being configured to support three independent channels, one for each display pipeline • There are two Intel FDI channels, each one consists of four unidirectional downstream differential transmitter pairs: —...

Processor Graphics Controller (GT) • • • • Intel® Rapid Memory Power Management (Intel® RMPM) – CxSR Intel® Graphics Performance Modulation Technology (Intel® GPMT) Intel® Smart 2D Display Technology (Intel® S2DDT) Graphics Render C-State (RC6) • Intel Seamless Display Refresh Rate Switching with eDP port Thermal Management Support • Digital Thermal Sensor • Intel Adaptive Thermal Monitor • THERMTRIP# and PROCHOT# support • On-Demand Mode • Open and Closed Loop Throttling • Memory Thermal Throttling • External Thermal Sensor (TS-on-DIMM and TS-on-Board) • Render Thermal Throttling • Fan...