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Intel® Xeon® Processor E3-1200 v5

Intel® Xeon® Processor E3-1200 v5

Product catalog summary

Introduction
The document introduces the Intel® Xeon® Processor E3-1200 v5 Product Family, focusing on supported technologies, power and thermal management, and package support. It also discusses processor testability and related documents.

Interfaces
This section details the system memory interface, including DDR3L and DDR4 support, memory timing, organization modes, and frequency. It also covers PCI Express* Graphics Interface, Direct Media Interface (DMI), and processor graphics, including operating systems and API support.

Technology
The document discusses Intel® Virtualization Technology, security technologies like Intel® Trusted Execution Technology and Intel® AES-NI, and power and performance technologies such as Intel® Hyper-Threading and Turbo Boost Technology 2.0.

Power Management
Power management strategies include ACPI states, processor core power management, integrated memory controller power management, and PCI Express* power management.

Thermal Management
This section covers processor thermal management, including thermal considerations and Intel® Turbo Boost Technology 2.0 power monitoring and control.

Supported Technologies
The processors support a range of technologies including Intel® Virtualization Technology, Intel® Active Management Technology 11.0, Intel® Trusted Execution Technology, Intel® Hyper-Threading Technology, and Intel® Turbo Boost Technology 2.0.

Power Management Support
The processors support various power management features including ACPI C-states, Enhanced Intel SpeedStep® Technology, and system power management states (S0/S0ix, S3, S4, S5).

Thermal Management Support
Thermal management features include a Digital Thermal Sensor, Intel® Adaptive Thermal Monitor, and support for thermal throttling and fan speed control.

Package Support
The processor is available in a 37.5 mm x 37.5 mm LGA package (LGA1151).

Processor Testability
An XDP on-board connector is required for full debug capabilities. The processor includes boundary-scan for board and system level testability.

System Memory Interface
The processor supports two channels of DDR3L/-RS and DDR4/-RS memory with a maximum of two DIMMs per channel.

Processor DRAM Support Matrix
The document outlines the DRAM support for the Intel® Xeon® Processor E3-1200 v5 line, detailing supported memory speeds of 1866 MT/s and 2133 MT/s for DDR4 modules.

Supported Memory Modules
The datasheet lists supported configurations for DDR3L/-RS and DDR4/-RS ECC UDIMM modules.

System Memory Timing Support
The Integrated Memory Controller (IMC) supports various DDR speed bins and command signal modes.

System Memory Organization Modes
The IMC supports single-channel and dual-channel modes, including Intel® Flex Memory Technology Mode.

Technology Enhancements
Intel® Fast Memory Access technology includes Just-in-Time Command Scheduling, Command Overlap, and Out-of-Order Scheduling.

PCI Express* Graphics Interface
The processor supports a 16-lane PCI Express* interface, configurable into multiple narrower ports.

PCI Express Configuration Space
The document describes the PCI Express configuration space, divided into a PCI-compatible region and an extended PCI Express region.

PCI Express Equalization Methodology
The equalization of PCI Express links involves adjusting both the transmitter (TX) and receiver (RX) sides.

Direct Media Interface (DMI)
DMI connects the processor and the PCH, supporting 4 lanes Gen 3 DMI with 8 GT/s point-to-point interface.

Processor Graphics
The processor graphics is based on GEN 9 architecture, supporting up to 72 Execution Units (EUs).

Display Interfaces
The processor supports single eDP and multiple DDI interfaces, configurable as DisplayPort or HDMI.

Switchable/Hybrid Graphics
The processor supports switchable graphics, allowing switching between integrated and discrete graphics.

GEN 9 Video Analytics
GEN 9 architecture includes hardware support for video analytics filters and transcoding features.

Display Interfaces
The processor supports three simultaneous display outputs using DisplayPort, HDMI, or DVI interfaces.

Audio Capabilities
The processor supports three High Definition audio streams over digital ports.

Display Configurations
Single Display, Intel® Display Clone, and Extended Desktop modes are supported.

Virtualization Technology
Intel® Virtualization Technology (VT) allows a single system to appear as multiple independent systems.

Platform Environmental Control Interface (PECI)
PECI provides a communication channel for processor temperature and performance management.

Virtualization Technologies
Intel® VT-x and VT-d provide hardware acceleration for virtualization, enhancing reliability and performance.

Security Technologies
Intel® Trusted Execution Technology (Intel® TXT) and Intel® AES-NI provide platform-level enhancements for security.

Intel Supervisor Mode Access Protection (SMAP)
SMAP enhances system protection by preventing malicious users from redirecting the operating system to user data.

Intel Memory Protection Extensions (Intel MPX)
Intel MPX provides hardware-accelerated memory testing to detect buffer overflow attacks.

Intel Software Guard Extensions (Intel SGX)
SGX enhances processor security by creating protected memory regions called Enclaves.

Power and Performance Technologies
Intel Hyper-Threading Technology (Intel HT) allows a processor core to function as two logical processors.

Intel Turbo Boost Technology 2.0
Enables the processor to run faster than its base frequency under certain conditions.

Intel Advanced Vector Extensions 2 (Intel AVX2)
Extends the Intel instruction set with 256-bit integer instructions and other enhancements.

Power Management Overview
The document provides detailed information on power management states for the Intel® Xeon® Processor E3-1200 v5 Product Family.

Core and Package States
Core States (C-states) include C0 (active), C1/C1E (auto-halt), C3 (deep sleep), C6 (deep power down), C7, and C8.

System States
The document also describes system states such as G0/S0 (full on), G1/S3 (suspend-to-RAM), G1/S4 (suspend-to-disk), G2/S5 (soft off), and G3 (mechanical off).

Power Management Technologies
Enhanced Intel SpeedStep® Technology allows the operating system to control processor frequency and voltage.

Low-Power Idle States
Idle states are used to save power when the processor is not executing code.

Auto-Demotion of C-States
The processor supports auto-demotion of deeper C-states to shallower ones to improve battery life and idle power efficiency.

Break Events and State Transitions
The document details how the processor exits low-power states in response to break events.

Package C-States
Package C0 State is the normal operating state where at least one processor core is active.

Dynamic LLC Sizing
The LLC (Last Level Cache) is dynamically managed, being flushed or resized based on core state requests.

Integrated Memory Controller (IMC) Power Management
The IMC manages power by disabling unused memory outputs and employing various power-down modes for DRAM.

PCI Express* Power Management
Active power management is supported using the L1 state.

Processor Graphics Power Management
Intel Rapid Memory Power Management (RMPM) places memory into self-refresh in deeper power states.

Voltage Optimization
Reduces power consumption opportunistically, available on selected SKUs.

Thermal Management
Processor Thermal Management ensures processor operates below maximum junction temperature (TjMAX) for reliability.

Adaptive Thermal Monitor
The Adaptive Thermal Monitor is designed to reduce processor IA core power consumption and temperature to stay below the maximum operating temperature.

Frequency/Voltage Control
Upon activation, the processor dynamically reduces temperature by lowering frequency and voltage.

Clock Modulation
If frequency/voltage changes are insufficient, clock modulation is used, turning clocks on and off at a specific duty cycle.

Digital Thermal Sensor (DTS)
The processor includes multiple on-die DTS to detect instantaneous temperature.

PROCHOT# Signal
PROCHOT# is asserted when the TCC is active, indicating high temperature.

Voltage Regulator Protection
PROCHOT# can protect voltage regulators by transitioning the processor to the lowest P-State when VR temperature limits are reached.

THERMTRIP# Signal
In catastrophic cooling failure, the package shuts down automatically when a critical temperature is reached.

Critical Temperature Detection
This feature monitors package temperature for graceful shutdown before THERMTRIP# activation.

On-Demand Mode
This auxiliary mechanism allows system software to force power reduction using clock modulation.

Intel® Memory Thermal Management
The processor can throttle memory traffic to protect system memory, with two levels of throttling based on customizable warm and hot thresholds.

Scenario Design Power (SDP)
SDP is a design specification for average power dissipation and junction temperature.

Thermal and Power Specifications
Detailed specifications for Thermal Design Power (TDP) and Thermal Test Vehicle (TTV) profiles are provided.

Thermal Metrology
TTV case temperatures are measured at the geometric top center of the integrated heat spreader.

Signal Description
The document describes processor signals, categorized by interface or function.

DDR3L/-RS and DDR4/-RS Memory Interface
The document outlines the signal names, descriptions, directions, buffer types, link types, and availability for DDR3L/-RS and DDR4/-RS memory interfaces.

PCI Express* Graphics (PEG) and Direct Media Interface (DMI) Signals
The document details the signals for PCI Express* and DMI interfaces.

Reset and Miscellaneous Signals
Configuration signals, platform reset, processor select, debug pins, and processor audio signals are described.

Display Interface Signals
The document describes embedded DisplayPort* (eDP*) and Digital Display Interface (DDI) signals.

Processor Clocking and Testability Signals
The document outlines the processor clocking signals, including differential bus clock inputs, and testability signals.

Error and Thermal Protection Signals
Signals related to catastrophic errors, platform environment control, processor temperature monitoring, and thermal trip are detailed.

Power Sequencing Signals
The document describes signals related to processor power good indications, processor detect/socket occupied, and power management interfaces.

Processor Power Rails
The document briefly mentions the processor IA cores power rail signal.

Electrical Specifications
The document outlines the electrical specifications for the Intel® Xeon® Processor E3-1200 v5 Product Family.

Package Mechanical Specifications
The processor uses Flip Chip technology in a Land Grid Array (LGA) package.

Catalog excerpts

Intel® Xeon® Processor E3-1200 v5 Product Family Datasheet - Volume 1 of 2 October 2015

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