Intel® Core™ i7 Processor Family for LGA2011 Socket Datasheet – Volume 1 of 2 Supporting Desktop Intel® Core™ i7-4960X Extreme Edition Processor Series for the LGA2011 Socket Supporting Desktop Intel® Core™ i7-49xx and i7-48xx Processor Series for the LGA2011 Socket

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Revision History Revision Number 001 002 Initial release Chapter , "1 Introduction 9," — Section 1.3.1, “System Memory Support” corrected DDR3 DRAM technologies supported

Introduction The Intel® Core™ i7 processor family for LGA2011 socket are the next generation of 64-bit, multi-core desktop processors built on 22-nanometer process technology. Based on the low-power/high-performance Intel® Core™ i7 processor micro-architecture, the processor is designed for a two-chip platform instead of to the traditional three-chip platforms (processor, Memory Controller Hub, and Platform Controller Hub). The twochip platform consists of a processor and the Platform Controller Hub (PCH) enabling higher performance, easier validation, and improved x-y footprint. Refer to Figure...

Processor Platform Block Diagram Example Processor Feature Details • Up to 6 execution cores • Each core supports two threads (Intel® Hyper-Threading Technology), up to 12 threads per socket • 32KB instruction and 32-KB data first-level cache (L1) for each core • 256KB shared instruction/data mid-level (L2) cache for each core • Up to 15MB last level cache (LLC): up to 2.5MB per core instruction/data last level cache (LLC), shared among all cores

Supported Technologies • Intel® Virtualization Technology (Intel® VT) • Intel® Virtualization Technology (Intel® VT) for Directed I/O (Intel® VT-d) • Intel® Virtualization Technology (Intel® VT) Processor Extensions • Intel® 64 Architecture • Intel® Streaming SIMD Extensions 4.1 (Intel® SSE4.1) • Intel® Streaming SIMD Extensions 4.2 (Intel® SSE4.2) • Intel® Advanced Vector Extensions (Intel® AVX) • Intel® AVX Floating Point Bit Depth Conversion (Float 16) • Intel® Hyper-Threading Technology • Execute Disable Bit • Intel® Turbo Boost Technology • Enhanced Intel® SpeedStep® Technology System Memory...

PCI Express* • The PCI Express* port(s) are fully-compliant with the PCI Express* Base Specification, Revision 3.0 (PCIe 3.0) • Support for PCI Express* 3.0 (8.0 GT/s), 2.0 (5.0 GT/s), and 1.0 (2.5 GT/s) • Up to 40 lanes of PCI Express* interconnect for general purpose PCI Express* devices at PCIe* 3.0 speeds that are configurable for up to 10 independent ports • 4 lanes of PCI Express* at PCIe* 2.0 speeds when not using DMI2 port (Port 0), also can be downgraded to x2 or x1 • Negotiating down to narrower widths is supported, see Figure 1-2: — x16 port (Port 2 and Port 3) may negotiate down to...

PCI Express* Lane Partitioning and Direct Media Interface Gen 2 (DMI2) Port 0 DMI / PCIe Direct Media Interface Gen 2 (DMI2) • Serves as the chip-to-chip interface to the PCH • The DMI2 port supports x4 link width and only operates in a x4 mode when in DMI2 • Operates at PCI Express* 1.0 or 2.0 speeds • Transparent to software • Processor and peer-to-peer writes and reads with 64-bit address support • APIC and Message Signaled Interrupt (MSI) support. Will send Intel-defined “End of Interrupt” broadcast message when initiated by the processor. • System Management Interrupt (SMI), SCI, and SERR...

Platform Environment Control Interface (PECI) The PECI is a one-wire interface that provides a communication channel between a PECI client (the processor) and a PECI master (the PCH). Refer to the Processor Thermal Mechanical Specifications and Design Guide for additional details on PECI services available in the processor (Refer to the Related Documents section). • Supports operation at up to 2 Mbps data transfers • Link layer improvements to support additional services and higher efficiency over PECI 2.0 generation • Services include processor thermal and estimated power information, control...

Package Summary The processor socket type is noted as LGA2011. The processor package is a 52.5 x 45 mm FC-LGA package (LGA2011). Refer to the Processor Thermal Mechanical Specification and Design Guide (see Related Documents section) for the package mechanical specifications. Terminology (Sheet 1 of 3) Term ACPI Description Advanced Configuration and Power Interface Active State Power Management Continuous Conduction Mode Discontinuous Conduction Mode Third generation Double Data Rate SDRAM memory technology that is the successor to DDR2 SDRAM Direct Memory Access Direct Media Interface Direct...

Terminology (Sheet 2 of 3) Term Intel® Virtualization Technology (Intel® VT) for Directed I/O. Intel VT-d is a hardware assist, under system software (Virtual Machine Manager or operating system) control, for enabling I/O device virtualization. Intel VT-d also brings robust security by providing protection from errant DMAs by using DMA remapping, a key feature of Intel VT-d. Any timing variation of a transition edge or edges from the defined Unit Interval (UI). Joint Test Action Group The LGA2011-0 land FCLGA package mates with the system board through this surface mount, LGA2011-0 contact socket....