2860 SERIES PCB CLAMPING STAGE 2860-200 The clamping stage may be mounted directly to the base of a testing machine or it can be fitted to an X-Y translation stage (e.g. Instron® 2860-101) in order to provide accurate adjustment and indexing of the specimen position during testing. The PCB clamping stage provides a rigid clamping base for the testing of microelectronic circuit boards and components. In a typical test configuration the assembly under test would be mounted in the 2860-200 PCB clamping stage fitted to an X-Y translation stage (e.g. Instron 2860-101) or directly to the base of a test machine and a lead pull grip would be mounted below the load cell on the moving crosshead or actuator. • Capacity: 500 N (100 lb, 50 kgf) • Clamping span: Adjustable 0 to 150 mm (0 to 6 in) • Variable specimen thickness • Fitting: Type Om (12 mm connection with 6 mm clevis pin), may also be mounted on 2860-101 Theta-X-Y manual translation stage. www.instron.com Worldwide Headquarters 825 University Ave, Norwood, MA 02062-2643, USA Tel: +1 800 564 8378 or +1 781 575 5000 European Headquarters Coronation Road, High Wycombe, Bucks HP12 3SY, UK Tel: +44 1494 464646 Instron is a registered trademark of Illinois Tool Works Inc. (ITW). Other names, logos, icons and marks identifying Instron products and services referenced herein are trademarks of ITW and may not be used without the prior written permission of ITW. Other product and company names listed are trademarks or trade names of their respective companies. Copyright © 2021 Illinois Tool Works Inc. All rights reserved. All of the specifications shown in this document are subject to change without notice. pod_2860_2