Temperature BondSens
2Pages

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Catalog excerpts

Temperature BondSens - 1

Platinum sensor One of the worlds smallest platinum RTD Very small size Perfect for high volume applications with high integration rate Full platinum RTD stability according to IEC 60751 Optimal for wearables, temperature control of LEDs or high power ICs Integratable with semiconductor devices Designed for Au-wire bonding Customer-specific sensor available upon request 1) For actual size, see dimensions Technical Data Nominal resistance:* Characteristics curve:* Long-term stability: Operating temperature range: Tolerance class (dependent on temperature range):* 3FC Au-Pads (bonding pads) 2) Self-heating must be considered * Customer-specific alternatives available

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Temperature BondSens - 2

Order Information - 3FC (Au-Pads - bonding pads) Size Order code Additional Documents Document name: ATP_E Application Note: Innovative Sensor Technology IST AG, Stegrütistrasse 14, 9642 Ebnat-Kappel, Switzerland Phone: +41 71 992 01 00 | Fax: +41 71 992 01 99 | Email: info@ist-ag.com | www.ist-ag.com All mechanical dimensions are valid at 25 °C ambient temperature, if not differently indicated • All data except the mechanical dimensions only have information purposes and are not to be understood as assured characteristics • Technical changes without previous announcement as well as...

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