Platinum precision at MEMS scale, enabled by platinum-on-silicon platform technology physical ■ chemical ■ biological

Silicon-based temperature sensors Temperature measurement companies are being asked to do more in less space. Datacom modules, medical instruments, optical lenses and lasers, semiconductor testing equipment and precision control loops need sensing elements that shrink without giving up accuracy or long-term stability. Ceramic platinum elements deliver the accuracy but are limited in miniaturization; NTC thermistors deliver the size but not the stability or interchangeability. iST's Pt-on-Si platform is the third option - reliable platinum thin films deposited and patterned on silicon substrates...

HANDHELD DEVICES SUSTAINABLE ENERGY BondSens Si: iST's smallest PTC sensor Miniaturized Pt-PTC on a 0.5 × 0.5 mm² silicon chip Solution A silicon-based chip suited to both small and large volumes, with miniaturization beyond 0.5 × 0.5 mm² available. Nominal values of 220, 1000, 2000 and 5000 Ω. Challenge Make a platinum temperature sensor smaller, with better price performance – a genuine third option between the Pt ceramic element and the NTC. Benefits Low design effort with platinum thin-film performance. New options for chip-onboard temperature measurement, where the sensor sits directly on...

iST offers a wide range of sensors based on different technologies suitable for any application. Chip geometry flexibility Chip thickness flexibility 30 µm thickness Design freedom at a glance Established process flow combining reliable Pt thin films and silicon MEMS processes! Reliable Pt thin film Any shape by silicon etching Benefits of silicon-based sensors  Miniaturization Thin-film platinum patterned by photolithography allows high resistance values in very small areas. Up to 5 kΩ fits on 0.25 mm² of active area, and chip outlines below 0.5 × 0.5 mm² are achievable. Silicon etching defines...

Temperature control element designed for a single customer's geometry Precise temperature control with long-term stability, on a demanding chip design - rounded edges and a through-hole within a 0.5 x 0.5 mm2 outline. A customized chip design with adapted shape and thickness, etched holes matched to the mechanical construction, and heater plus temperature sensor on the same chip so control and measurement share a thermal path. Compatible with adjacent silicon components. A unique design for each customer, high flexibility in layout, the stability of platinum as the sensing material, and good...

Photolithography Screen printing Laser trimming Dry & wet etching Welding Bonding Soldering Hot-melt molding Injection molding Connection PTFE or PEEK insulated Ag, Ni/Au, Pt wire Cu/Ag, Cu/Ni wire AWG 34 to 20 Flat or round wire Multistranded cables Ultra-thin wires Custom lengths Bondable, solderable Brazeable, weldable SMD & FlipChip ...and many more Substrate Alumina Aluminium nitride Metal thin film Metal thick film Dielectric thin film Dielectric thick film Innovative Sensor Technology IST AG Stegrutistrasse 14 ■ 9642 Ebnat-Kappel ■ Switzerland +41 71 992 01 00 ■ [email protected]