Product Information The Robust Path to Automotive Networks www.infineon.com/transceivers * and representative offices Edition 2008 Published by Infineon Technologies AG 81726 Munich, Germany © 2008 Infineon Technologies AG All rights reserved.

Embedded Power – Relay Driver ICs – TLE78xx: Application Example W O R L D L E A D E R I N A U T O M O T I V E electronics for 35 years, Infineon focuses on the in-vehicle networking, a major driver today for innovation in the automotive field, meeting the ever-increasing demands of consumers for comfort, interfaces, Infineon offers an extensive product line of transceivers, system basis chips and Embedded Power solutions for CAN and LIN protocols, from the mature to the advanced. Relay Driver C O N T I N U O U S L Y I M P R O V I N G its S P T chip technology, Infineon provides solutions for...

Infineon Transceivers and System Basis Chips The experience of a leading edge automotive electronics supplier Comprehensive product portfolio of stand-alone transceivers and standard on-chip solutions Outstanding ESD and EMC combined performances Basis Chips Embedded Power Abbreviations SPT Smart Power Technology ESD Electro Static Discharge SBC System Basis Chip OEM Original Equipment Manufacturer EMC Electro Magnetic Compatibility LIN Local Interconnect Network CAN Controller Area Network ePower: Embedded Power

The Benefits of an Automotive Dedicated Technolog y Living Automotive Excellence B eca u se t r ansceive r s play a vital role in today’s more and more complex interconnected cars, developing i ­ nnovative solutions is not enough. With the “Automotive Excellence” program Infineon can ensure the highest safety ­ ossible, p implementing a zero-defect mind-set for processes, product development, production and logistics: no compromise when it comes to quality! First results can be recognized already. volume in pcs/BY quarter

robust Package: for a safer lead-free processing A N E L E M E N T O F T h E A u T O M O T I V E E x C E L L E N C E P r O G r A M , the robust package, significantly improves the reliability of both, the component and the application. This new package concept enables Infineon to address the lead-free requirements with improved quality, going beyond the today’s AEC Q101 specifications. Green and Robust package Solder Die Attach (PbSnAg) Low Stress / Molding Compound MC allowing increased solder reflow (260 °C) due to green requirement halogen free reducing thermomechanical stress in package Plating...

ESD Robustness: holding the leadership in performance and innovation O ne of t h e specific c h allenges for a transceiver device is to withstand the harsh signals that occur on the bus, from ESD (Electro Static Discharges) to voltage peaks resulting from the parasitic inductances of bus cables. A robust t ­ ransceiver also does not need expensive external protection components such a zener diodes or varistors. O ve r t h e past y ea r s Infineon developed and improved an innovative integrated protection that enables the d ­ issipation of the energy, which is converted during an ESD event, through...

Stand-alone Transceivers High Speed CAN Transceivers Excellent robustness dedicated to a broad range TLE6251G – for permanently connected nodes a ­ ddition the supply for the entire node. Permanently powered A t fi r st u sed for powertrain networks, the High Speed Controller Area Network (CAN) is now the most used by the battery, it features a sleep mode with very low quiescent automotive protocol within the car, with bus speeds from current and an inhibit output to power up a voltage regulator, 125 kBauds to 1 Mbauds, offering an excellent cost to when getting either a remote wake-up from the...

Stand-alone Transceivers Low Speed CAN Transceivers Setting up a new reference T h e 1 2 5 k B a u d Fault Tolerant CAN physical layer became a standard in Europe for body and convenience networks because of its ability to switch from a differential Application example TLE6254-3G VBAT CAN Bus communication mode to a single-wire mode in the event of an open or shorted bus wire. Infineon continuously improved the performances and the functionalities of its Fault Tolerant t ­ ransceivers resulting in the advanced TLE6254-3G, establi- shing a new reference on the Low Speed CAN transceiver TLE6254-3G...

LIN Transceivers Top performances for low-cost networking TLE7269G – the first ever Twin-LIN device L ocal I nte r connect N etwo r k (LIN) bus by allowing a basic local network connection between the CAN T h e T L E 7 2 6 9 G offers two LIN transceiver cells type TLE7259-2 in a SO14 package, which gives ­ dditional benefits: a backbone and actuators, sensors or switches has tremendous­ Smaller overall board area ly reduced the design efforts and costs. It is thus used in a Integrated pull-up resistors to Vcc for logic pins fast-growing range of body and convenience applications. As Reduced total...

System Basis Chips I nfineon h as developed several integrated components to enable the design of cost-effective, robust and Customer’s Benefit high-performance modules, to meet the harsh requirements of the automotive industry for quiescent current, system area and the design-in time significantly. The hardware is herewith s ­ implified, and the software can be adapted to fit to new Using a standa r d integrated solution, reduces requirements, enabling an efficient reuse of the running A s a well - establis h ed automotive supplier, Infineon combines its experience with a wide portfolio of transceivers,...

A s a pionee r of System Basis Chips solutions, Infineon has offered SBCs with Fault Tolerant Low Speed CAN interface since 1998, dedicated to body and convenience Charge pump modules. The products below benefit from the performances of the latest transceiver cell generation. OUTH1 Switch fall defect T h e T L E 6 2 6 3 - 3 G meets the main smart power and Drive supply requirements, among the most important features: Fault Tolerant Low Speed CAN transceiver Drive UVLO Window watchdog Fault Tolerant Low Speed CAN transceiver Voltage regulator (5 V / 45 mA) 2 Low Side drivers Fail management module...