1. Overview and Contact Information

This pocket guide, published by Infineon Technologies AG in 2012, provides a comprehensive technical reference for selecting microcontrollers. Headquarters contact is available in Munich (+49 89 234 65555) with international toll-free support (0(0)800 951 951 951). Further information can be found at www.infineon.com/microcontrollers.

2. Microcontroller Families and Input Voltage Ranges

• XC800 Family: 3.0 – 5.5 V, 8/16-bit microcontrollers for automotive and industrial applications.
• XE166/XC2000 Families: 3.0 – 5.5 V, 16/32-bit automotive microcontrollers with various series targeting body and safety applications.
• TriCore™ Family: 1.5 – 3.3 V, high-performance 32-bit microcontrollers with integrated co-processors for automotive and industrial use.
• XMC4000 Family: 3.3 V, 32-bit microcontrollers designed for industrial and multi-market applications.

3. Key Parameters and Features

The guide tabulates critical specifications across families, including:

• Max Clock Frequency: 10 MHz to 300 MHz, scaling from low-end to high-performance devices.
• Program Memory: 0 KB to 4000 KB (4 MB), accommodating diverse application needs.
• SRAM (including Cache): 1.25 KB to 320 KB.
• Co-Processors: MAC (Multiply-Accumulate Unit), FPU (Floating Point Unit), PCP (Peripheral Control Processor), VC (Vector Computer).
• Digital I/O Lines: 9 to 252 lines.
• ADC Channels: 0 to 72 channels.
• Timed I/O Channels: PWM, CAPCOM, GPTA ranging up to 138 channels.
• External Bus Interface: Available on many models for expanded connectivity.
• CAN Nodes: Up to 6 nodes supported.
• Communication Interfaces: USIC (Universal Serial Interface Channel), SPI, LIN, FlexRay, Ethernet (10/100 Mbit/s), USB, ASC, SSC, MSC, MLI, SENT, BSL, SDLM.
• Temperature Ranges: Codes B, F, X, K, A, L, H representing ambient operating temperatures from 0°C to 150°C.
• Package Types: PG-LQFP, PG-VQFN, PG-TSSOP, PG-LFBGA, PG-BGA with pin counts from 38 to 516.
• Additional Features: Embedded Voltage Regulators (EVR), Memory Management Units (MMU), High Current Pads (HCP), Touchpad Libraries (TP), ROM/OTP memory options.

4. Microcontroller Series Highlights

XC2000 Family (Automotive Applications)

• Models such as XC226x and XC228x with max clock frequencies up to 128 MHz.
• Program memory ranges from 32 KB to 1600 KB.
• Co-processors primarily MAC units.
• Communication includes up to 10 USIC channels and FlexRay on higher-end models.

XC2300 Series (Safety Applications)

• Safety-focused models like XC2365 and XC2387.
• Max clock frequency around 66 MHz.
• Program memory up to 576 KB.

XMC4000 Series (Industrial and Multi-Market)

• Max clock frequency of 120 MHz with Floating Point Units.
• Program memory up to 1024 KB and SRAM up to 160 KB.
• Communication interfaces include Ethernet 10/100 Mbit/s and USB.
• Embedded Voltage Regulators included.

TriCore™ Family (Automotive and Industrial)

• Wide clock frequency range from 66 MHz to 300 MHz.
• Program memory up to 4000 KB.
• Co-processors include FPU and PCP.
• Rich communication interfaces: ASC, SSC, MSC, MLI, FlexRay, SENT.
• Temperature ratings up to 150°C and packages up to 516 pins.

XC800 Family (Automotive and Industrial)

• 8-bit and 16-bit microcontrollers with clock frequencies from 10 MHz to 27 MHz.
• Program memory up to 64 KB and SRAM up to 3 KB.
• Communication interfaces include UART, SCC, LIN, USART, SSC, and I2C.
• Various packaging options including MQFP, TSSOP, VQFN, LQFP, and DSO.

C166 Family

• 16-bit microcontrollers with clock speeds from 20 MHz to 40 MHz.
• Program memory up to 256 KB and SRAM up to 16 KB.
• Includes MAC co-processors and communication interfaces such as ASC, SSC, I2C, UART, and J1850.

XE166 Real Time Signal Controller

• Multiple series with clock frequencies from 40 MHz to 80 MHz.
• Program memory from 32 KB to 768 KB and SRAM from 8 KB to 82 KB.
• MAC co-processors and USIC communication interfaces.
• Packaging includes LQFP, TSSOP, and VQFN.

5. Communication Interfaces and Temperature Codes

Communication Interfaces Explained:

• USIC: Supports ASC, SSC, LIN, I2C, I2S protocols.
• ASC: Asynchronous Serial Channel.
• SSC: Synchronous Serial Channel.
• LIN: Local Interconnect Network.
• SPI: Serial Peripheral Interface.
• FlexRay: High-speed automotive network protocol.
• Ethernet: 10/100 Mbit/s support in XMC4000 devices.
• USB: Universal Serial Bus support in selected devices.

Temperature Range Codes:

• B: 0 to 70°C
• F: -40 to 85°C
• X: -40 to 105°C
• K: -40 to 125°C
• A: -40 to 140°C
• L: -40 to 150°C
• H: -40 to 110°C

6. Additional Features and Remarks

• Embedded Voltage Regulators (EVR) available on some models.
• Memory Management Units (MMU), Touchpad Libraries (TP), High Current Pads (HCP), and One Time Programmable (OTP) memory options noted.
• Super Set devices are highlighted as recommended for sampling.

7. Summary of Key Parameters for Selected Series

• XE162xM (M-Series): 80 MHz clock, 384-576 KB program memory, 24-50 KB SRAM, MAC co-processor, 40 digital I/O lines, 9 ADC channels, 23 timed I/O channels, 6xUSIC interfaces, temperature range F,K, PG-LQFP-64 package.
• XC228xH (H-Series): 100 MHz clock, 1600 KB program memory, 138 KB SRAM, MAC co-processor, 119 digital I/O lines, 24 ADC channels, 44 timed I/O channels, 10xUSIC, 2xFlexRay interfaces, temperature range F,K, PG-LQFP-144 package.
• TC1798F-512F300EP (AUDO-MAX Family): 300 MHz clock, 4000 KB program memory, 288 KB SRAM, FPU and PCP co-processors, 252 digital I/O lines, 72 ADC channels, 138 timed I/O channels, multiple communication interfaces including ASC, SSC, MSC, MLI, SENT, FlexRay, temperature range K, PG-BGA-516 package.

8. Conclusion

This pocket guide is a detailed technical reference enabling engineers to select Infineon microcontrollers tailored to specific application requirements. It covers a broad spectrum from low-power 8-bit devices to high-performance 32-bit and TriCore™ processors, addressing automotive, industrial, safety-critical, and multi-market needs. The guide emphasizes scalability, communication capabilities, environmental tolerance, and packaging diversity, making it a valuable resource for embedded system design.