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InduBond ® X-Press

InduBond ® X-Press
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InduBond ® X-Press

Product catalog summary
Introduction to X-Press Technology: InduBond introduces X-Press, a groundbreaking method for laminating printed circuit boards (PCBs) using Induction Heating Technology. This technology ensures precise energy delivery to cure resins without thermal delays across all directions (X, Y, and Z) of the stack.
Key Features:
  • Induction Heating: Provides precise energy delivery for resin curing.
  • Cold Cycle: Conducted in the same chamber using controlled air flow speed and water temperature.
  • Hydraulic Pressure: Offers high uniform pressure up to 75Kg/Cm2 (1066PSI).
  • Vacuum Levels: Achieves high vacuum levels due to a specific single frame design and durable seal.
  • Temperature Capability: Can withstand high temperatures up to 450ºC (842F).
  • Design: Features a modular and compact design.
  • Patent: The technology is patented worldwide.
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Catalog excerpts

InduBond ® X-Press-1

Using Induction Heating Technology to deliver precisely the energy to cure the resins with no thermal delays in any direction of the stack. X, Y and Z direction. InduBond is presenting X-Press, the revolutionary new way of laminating PCB. Cold Cycle is also done in the same chamber by forced air controlling air flow speed and water temp. High uniform hydraulic pressure up to 75Kg/Cm2 (1066PSI) High Vacuum levels due to specific single frame design and long live seal. High Temperature capability 450ºC (842F) Modular concept and very compact design. World Wide Patented

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