Ideal for Flex, Rigid-Flex Technology. High precision layer to layer Pin registration. Inductive Bonding Technology (InduBond®) to assure best registration. InduBond® , High Accuracy Flex, Flex-Rigid, Rigid PCB's Pin Registration Machine for Pin Less Lamination The bonding spots withstand the movements of the inner layers during the hot press cycle. Four bonding heads working simultaneously and independent with X/Y movement to place bonding locations for fixing the registration prior to lamination in any location of the PCB. Bonding locations are loaded directly from the Gerber files. All laminates materials can be bonded (FR4, Htg FR4, Rogers, Polyamide...). Cost reduction in tool pins, bushings and tooling plates due to Pin less Lamination Process. Tooling templates are removable and can be placed on table tops for more lay-up capacity or automation. (Ideal for sequential build-up)

General Description InduBond® RFX is the new system process and equipment that has been developed to improve the crucial factors associate with fabrication of complex multi layer PCBs rigid, rigid-flex and flex. This new generation of the InduBond® bonding machines can bond multiple number of bonding points in any location of the multi layer stack-up for best registration. The bonding points could be placed anywhere along the edges or inside the real state or circuit image area. Those bonding spots works as virtual pins to help the scale constrain, similar as multiple tooling pins around of single...

Technical Data Process Specifications: Max. Inner Layer Size: L.750 x W.650 mm (30x25”) Min. Inner Layer Size: L.304.8 x W.304.8 mm (12x12”) Max. Bonding Thickness: Up to 10 mm Min, Bonding thickness: No limit Min. Layer thickness: 25µm (1 mil) Max. Bonding temperature: 350˚C (662˚F) Air pressure Connection Max. pressure 10bar Working pressure 6bar Inlet plug size Ø8 mm Air Consumption <2000 liters/hour Water cooling connection Inlet plug size Ø12 mm Outlet plug size Ø12 mm Min. Input Temp. 100C Max. Input Temp. 180C Min. Flow rate 100 liter/hour Internal chiller through by-pass Electrical Connection:...

Chemplate Materials, S.L. C/ Empordà, 23 - P.I. Can Bernades - Subirà 08130 Santa Perpètua de Mogoda Barcelona - Spain Tel. +34 93 574 43 00 Fax +34 93 574 42 78 [email protected] www.indubond.com InduBond® is a trademark of Chemplate Materials, S.L. in Spain and/or other countries. All rights reserved. InduBond® technology is a patented technology by Chemplate Materials, S.L. and protected by international laws. Specifications subjects to change without any notice.