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InduBond® , High Accuracy Pin Registration Machine For Pin Less Lamination

InduBond® , High Accuracy Pin Registration Machine For Pin Less Lamination

InduBond® , High Accuracy Pin Registration Machine For Pin Less Lamination

Product catalog summary
General Description: The InduBond 230N is a high-accuracy pin registration machine designed for pin-less lamination of multilayer printed circuits. It features a double drawer system and uses inductive bonding spots to ensure precise layer-to-layer registration, reducing mechanical stress and warping effects during the lamination process.
Technical Specifications: The machine supports a maximum inner layer size of 750 x 650mm and a minimum size of 250 x 250mm. It can handle bonding thicknesses up to 10mm, with higher thicknesses available upon request. The installed power is 3Kw, requiring a 400 Volt, 3-phase power supply, and operates at an air pressure of 6 bar.
Procedure Description: The process involves placing internal cores and prepreg sheets on a tooling template, which is then moved to the bonding zone. The machine uses InduBond heads to press and heat the bonding spots, ensuring the resin is fused and cured. The typical bonding time for an 8-layer stack-up is approximately 45-60 seconds.
Standard Composition and Options: The standard setup includes the InduBond 230N machine, four inductive bonding heads, dedicated tooling templates, and technical support. Optional features include two additional bonding heads for larger panels.
Technical Requirements: The machine requires a suction hole of 80mm diameter with a minimum suction flow of 160 l/s. It ensures alignment accuracy of 14 microns and uses short circuit heaters for bonding areas.
Additional Information: InduBond technology is patented and trademarked by Chemplate Materials, S.L., with specifications subject to change without notice. The machine layout and technical data are available on the InduBond website.
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Catalog excerpts

InduBond® , High Accuracy Pin Registration Machine For Pin Less Lamination-1

InduBond 230N Double Drawer Machine!! Chemplate Materials, S.L. C/ Empordà 23 (esq. Anoia) P.I. Can Bernades-Subirà 08130 Santa Perpètua de la Mogoda Barcelona - Spain Tel. +34 93 574 43 00 Fax. +34 93 574 42 78 [email protected] www.indubond.com Double drawer machine. Inductive bonding spots to hold the layer to layer registration. Distributor Tag. High precision layer to layer Pin registration. InduBond , High Accuracy Pin Registration Machine For Pin Less Lamination InduBond® is a trademark of Chemplate Materials, S.L. in Spain and/or other countries. All rights reserved. InduBond® technology is a patented technology by Chemplate Materials, S.L. and protected by international laws. Specifications subjects to change without any notice. The bonding spots withstand the movements of the inner layers during the hot press cycle. It assures the best linear movements of the multilayer stack-up caused by thermal dilatations/shrinkage during lamination. It reduces the internal mechanical stress of the multilayer stack-up thereby reducing the warping effects. Constant and precise thickness over the entire surface. The flat bonding spots allow maximum and uniform pressure during the press cycle. Guarantee press plates long life and reduce cost of tooling plates, pins, bushings.. (No more hard tooling pla

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InduBond® , High Accuracy Pin Registration Machine For Pin Less Lamination-2

Procedure Description 1. Place the internal core #1 on the pins over the Tooling Template. General Description 2. Put on the prepreg sheets required for the stack-up. 3. Repeat step 1 and 2 until the multilayer stack-up is completed. InduBond® is a new generation of the inductive bonding machines by Chemplate for layer to layer pin registration and bonding the stack-up of inner layers and prepregs of a multilayer printed circuit. This process allows to laminate the multilayer boards without the needs of the pins and hard tooling plates. 4. Once the stack-up is complete, the operator must confirm...

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