Inductive bonding points to hold the layer to layer registration. High precision layer to layer Pin registration. InduBond® , High Accuracy Pin Registration Machine For Pin Less Lamination The bonding points withstand the movements of the inner layers during the hot press cycle. It assures the best linear movements of the multilayer stackup caused by thermal dilatations/shrinkage during lamination. It reduce the internal mechanical stress of the multilayer stack-up thereby reducing the warping effects. Constant and precise thickness over the entire surface. The flat bonding points allow maximum and uniform pressure during the press cycle. Guarantee press plates long life and reduce cost of tooling plates, pins, bushings... (No more hard tooling plates!)

General Description InduBond® 130N is a new generation of the inductive bonding machines by Chemplate for layer to layer pin registration and bonding the stack-up of inner layers and prepregs of a multilayer printed circuit. This process allows to laminate the multilayer boards without the needs of the pins and hard tooling plates. The process allows repeatability and reliability obtaining high registration precision between the inner layers (Tooling template accuracy <10 microns). The multilayer stack, previously mounted on a tooling template with high-precision mechanical pins, is bonded by...

Procedure Description 1. Place the internal layer #1 on the pins over the Tooling Template. 2. Put on the prepreg sheets required for the stack-up. 3. The machine automatically move the tooling template with the multilayer stack-up to the bonding zone. 4. Repeat step 1 and 2 until the multilayer stack-up is completed. 5. Once the stack-up is complete, the operator must confirm by a foot switch. 6. The machine closes the top plate (press) to keep the stack-up firmly flat and to ensure the correct lay-up alignment of all inner layers. 7. The Inductive Bonding Heads (InduBond®) close the electrodes,...

Chemplate Materials, S.L. C/ Empordà, 23 - P.I. Can Bernades - Subirà 08130 Santa Perpètua de Mogoda Barcelona - Spain Tel. +34 93 574 43 00 Fax +34 93 574 42 78 [email protected] www.indubond.com InduBond® is a trademark of Chemplate Materials, S.L. in Spain and/or other countries. All rights reserved. InduBond® technology is a patented technology by Chemplate Materials, S.L. and protected by international laws. Specifications subjects to change without any notice.