Company Overview and Capabilities

IMT Co., Ltd., founded in 1988 and headquartered in Wakayama, Japan, specializes in manufacturing production equipment for the semiconductor and LCD panel industries. The company offers comprehensive in-house mechanical and electrical design, assembly engineering, and customization services. Their product range includes sample preparation equipment, polishing machines, embedding and cutting machines, and consumables. IMT supports customers with dedicated engineering teams and a laboratory for sample preparation consultation. They maintain branches across Japan and an overseas office in Shanghai, China.

Polishing Machines and Sample Preparation Equipment

The company provides a broad lineup of polishing machines categorized into manual, semi-automatic, and fully automatic types:

• Manual/Semi-Automatic Machines: Models like IM-P2 (variable speed 0-400 rpm, supports 1-3 samples with spring-loaded pressure), SP-L1 (rotating sample holder to maintain parallelism), and SP-As1/As2 (roller-type rotation units with oscillation to reduce polishing resistance).
• Automatic Machines: E^o^2 dual-disc polisher (supports 4 samples with adjustable pressure), Q-roy series (compact automatic polishers with individual Z-axis control and touch panel operation), and Rana series (programmable pressure and speed profiles, memory for up to 16 polishing conditions, safety features, and support for large discs up to 305 mm).

Accessories and Consumables

IMT offers a wide range of accessories and consumables essential for sample preparation:

• Sample Holders and Fixtures: Various holders for different sample sizes and shapes, including vacuum suction and wax-mounted holders, plus special jigs for non-embedded and mineral samples.
• Cooling and Filtration: RYUZIN filtration systems with two-tank water circulation, selectable filters, leak sensors, and air regulators to promote water recycling and environmental sustainability.
• Leveling and Grinding Fixtures: Leveler 4 for samples up to 30 mm diameter and Q-Keeper grinding jig for manual polishing.
• Embedding and Pressing Equipment: Manual hand presses (H-MK, P-MK) and vacuum impregnation device (Gsn) for epoxy resin embedding under vacuum.
• Sample Drying Equipment: High-power dryers (λ-105, U-104) with airflow, heating, and foot switch operation.
• Automatic Polishing Agent Supply: Auto drip devices (Ndrip, Drip 5, Drip 1) with programmable dispensing intervals and volumes, compatible with automatic polishers.
• Polishing Consumables: Diamond polishing pads with magnetic backing, gel sheets (Octo Plates) to prevent lateral slipping, waterproof abrasive papers in various grits, magnetic pads and adhesive plates, diamond pastes and slurries (oil and water-based), polishing cloths made from natural silk, wool, acetate, and felt, lubricants tailored for diamond abrasives, and alumina abrasives including colloidal silica for final polishing.

Key Features and Best Practices

• Individual load polishing enables sequential sample removal upon reaching target depth, enhancing efficiency.
• Synchronizing rotation speeds and directions of holders and discs preserves sample parallelism and surface quality.
• Oscillation functions reduce polishing resistance and improve uniformity of surface finish.
• Programmable pressure and speed profiles allow gentle ramp-up, protecting delicate or sharp-edged samples.
• Memory functions for polishing conditions improve repeatability and productivity.
• Safety features such as dual start buttons prevent operational accidents.
• Water filtration and recycling systems support environmental sustainability by reducing waste.

Product Specifications and Characteristics

Resins and Hardeners: Various resin types are offered, including fast-curing acrylic (S60NK-FF series, curing in 15-20 minutes), transparent acrylic powders (S60AC-AJ), epoxy resins with glass fibers (S60EP-J), diallyl resins with low shrinkage (S60JA-J), conductive phenol resins for SEM applications (S60RG-J), and the ZeroMar series with different curing times and hardness ratings. Phenol resins are also available for general and electronic material use.

Abrasives and Slurries: Alumina suspensions and slurries are available in particle sizes from 0.05μm to 3μm, suitable for various polishing stages. UP colloidal silica polishing agents offer high hardness and stability, dispersible in organic solvents.

Consumables and Accessories: Clips for holding thin workpieces, plastic and silicone rubber molding cups for resin embedding, protective back grind tapes, thermo-softenable moldable materials (Tsukameru-kun) for sample handling, and adhesive wax that softens at 53°C for secure sample mounting.

Critical Parameters and Recommendations

• Resin curing times range from rapid 15-minute acrylics to 18-hour epoxy resins, with heat-accelerated options available.
• Abrasive particle sizes should be selected based on polishing requirements, from ultra-fine (0.045μm) to coarser (3μm).
• Conductive resins are recommended for SEM sample preparation to ensure proper conductivity.
• Protective tapes and clips are essential to maintain sample integrity during dual-side polishing and embedding processes.
• Adhesive wax softens at 53°C, facilitating secure yet gentle sample fixation.

Notes

• Product specifications are subject to change without prior notice.
• For specialized applications, particularly in electronic materials, users are encouraged to consult IMT for tailored guidance.

Summary

This catalog details a comprehensive suite of sample preparation equipment and consumables tailored for semiconductor and electronic material industries. IMT’s offerings emphasize customization, precision, safety, and environmental sustainability, supported by advanced machine features, extensive consumable options, and dedicated engineering and laboratory services.