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![iesy RPX30 OSM-SF - 1](https://img.directindustry.com/pdf/repository_di/240866/iesy-rpx30-osm-sf-1018031_1m.jpg)
STANDARD SOLUTION OSM™ - The standard for solder-on computer modules Technical Data ▶ Processor: ▶ Clock rate: ▶ RAM: ▶ Flash memory: ▶ Dimension: ▶ Footprint: ▶ Power supply: ▶ Power consumption: ▶ Temperature range: > Operating: > Storage: ▶ Software: PX30K Cortex-A35 Quad-Core 1.5 GHz 1 GByte LPDDR3 8 GByte e-MMC 5.1 30 mm x 30 mm OSM Size-S Land Grid Array (LGA), Solder-on modules with 332 contact points 5 V +/- 5 % via LGA contacts <3 W (typ.) -20 °C to +85 °C -40 °C to +85 °C Yocto based BSP ▶ Features & Interfaces > 1 × LAN 10/100 (RMII) > 1 × USB 2.0 Host > 1 × USB 2.0 OTG > 1x MIPI DSI (4 Lanes) > 1x MIPI CSI (4 Lanes) > 1x SD-Card > 2x SPI, 3x UART > 2x I2C, 1x I2S > 18x GPIO > 2x ADC (10 bit, SAR) iesy GmbH | Meinerzhagen | +49 (2354) 70655 0 | sales@iesy.com | www.iesy.com iesy RPX30 OSM-SF Rockchip PX30 Cortex A-35 Quad-Core Features The Size-S with its 30 mm x 30 mm size and Rockchip processor is the little brother of the module with NXP processor. In terms of functionality, it is certainly comparable in many respects, but it is a reasonable alternative in terms of cost. Like all Open Standard Modules™, the Size-S also has the option of responding flexibly to requirements. An open source Linux based on Yocto is used as operating system. The data is provided via a Git respository. iesy is a specialist for embedded computing solutions.. Driven by our passion for technology we have been developing electronic systems since 1966. With a team of experts in soft- and hardware development, manufacturing and device testing, we are an ideal outsourcing partner for the development, prototyping, series production and maintenance of customer-specific electronic products.
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