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iesy i.MX8M Mini OSM-SF

iesy i.MX8M Mini OSM-SF

Product catalog summary
Overview
iesy GmbH specializes in embedded computing solutions, offering development, prototyping, series production, and maintenance of electronic products. The company has been active since 1966 and provides expertise in both software and hardware development.

Product Description
The document describes the iesy RPX30 OSM-SF, a solder-on computer module featuring the Rockchip PX30 Cortex A-35 Quad-Core processor. It highlights the company's capability in providing standard solutions for embedded systems.

Technical Specifications
  • Processor: i.MX8M Mini Cortex-A53 Quad Core
  • Clock Rate: 1.6 GHz
  • RAM: 1 GByte LPDDR4
  • Flash Memory: 16 GByte e-MMC 5.1
  • Dimensions: 30 mm x 30 mm
  • Footprint: OSM Size-S Land Grid Array (LGA) with 332 contact points
  • Power Supply: 5 V +/- 5% via LGA contacts
  • Power Consumption: Less than 5 W (typical)
  • Temperature Range: Operating and storage from -40 °C to +85 °C
  • Software: Yocto based BSP

Features & Interfaces
  • 1 × LAN 10/100/1000 (RGMII)
  • 1x PCIe x1
  • 1x USB 2.0 Host
  • 1x USB 2.0 OTG
  • 1x MIPI DSI (4 Lanes)
  • 1x MIPI CSI (4 Lanes)
  • 1x SD-Card, 1x SDIO/MMC (x8)
  • 1x QSPI, 1x SPI, 4x UART
  • 2x I2C, 1x I2S (2x TX/RX)
  • 24x GPIO, 3x PWM
  • 1x JTAG

Additional Features
The Size-S module, with its compact 30 mm x 30 mm size, includes digital and analog video interfaces, multiple Gbit LAN ports, and a Camera Serial Interface (CSI). It supports flexible requirements and uses an open-source Linux operating system based on Yocto, with data provided via a Git repository.
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Catalog excerpts

iesy i.MX8M Mini OSM-SF-1

STANDARD SOLUTION iesy i.MX8M Mini OSM-SF OSM™ - The standard for solder-on computer modules Technical Data ▶ Processor: ▶ Clock rate: ▶ RAM: ▶ Flash memory: ▶ Dimension: ▶ Footprint: ▶ Power supply: ▶ Power consumption: ▶ Temperature range: > Operating: > Storage: ▶ Software: i.MX8M Mini Cortex-A53 Quad Core 1.6 GHz 1 GByte LPDDR4 16 GByte e-MMC 5.1 30 mm x 30 mm OSM Size-S Land Grid Array (LGA), Solder-on modules with 332 contact points 5 V +/- 5 % via LGA contacts <5 W (typ.) iesy RPX30 OSM-SF i.MX8M Mini OSM-SF i.MX8M Mini Cortex-A53 Quad Core Rockchip PX30 Cortex A-35 Quad-Core ▶ Features & Interfaces: > 1 × LAN 10/100/1000 (RGMII) > 1x PCIe x1 > 1x USB 2.0 Host > 1x USB 2.0 OTG > 1x MIPI DSI (4 Lanes) > 1x MIPI CSI (4 Lanes) > 1x SD-Card, 1x SDIO/MMC (x8) > 1x QSPI, 1x SPI, 4x UART > 2x I2C, 1x I2S (2x TX/RX) > 24x GPIO, 3x PWM > 1x JTAG iesy GmbH | Meinerzhagen | +49 (2354) 70655 0 | [email protected] | www.iesy.com Features The Size-S with its 30 mm x 30 mm size and i.MX8 processor has digital & analog video interfaces, several Gbit LAN ports and a Camera Serial Interface (CSI). Like all Open Standard Modules™ the Size-S also has the option of responding flexibly to requirements. An open source Linux based on Yocto is used as operating system. The data is provided via a Git repositor iesy is a specialist for embedded computing solutions.. Driven by our passion for technology we have been developing electronic systems since 1966. With a team of experts in soft- and hardware development, manufacturing and device testing, we are an ideal outsourcing partner for the development, prototyping, series production and maintenance of customer-specific electronic products. T

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