VAC745/765 Vacuum Batch Reflow Vapour Phase SolderingSV260 Oven The VAC-Series is an environmentally friendly and flexible soldering system dedicated for highest quality soldering. The patented vacuum chamber located in the process chamber ensures that highest solder quality with a minimum amount and size of voids is possible. Outstanding performance and quality results through the unique technology applied in these machines. Regardless of the number of layers in the board and high mix of components this machine can handle the toughest applications with fantastic results. The Intelligent Profiling System gives the user full control of temperature rise to reach the best and desired soldering profiles. Together with the unique patented Soft Vapour Phase there is no fear of exceeding temperature increase rates of components. Their outstanding low energy consumption and exhaust air volume compared to other soldering systems result in even lower running costs. Excellent heat transfer in an inert oxygen free atmosphere without the need of costly nitrogen. Two chamber system with a large touch display makes this machine user friendly, easy to set up and use. Soldering is possible regardless of assembly weight with the same profile. Transport of boards into the process chamber Observation window Vacuum unit inside of process chamber Comfortable 15” Touch-Screen Integrated PC, allows permanent data collection and professional data management Permanent data collection Unlimited program memory with a large amount of sample programs Network capable Password protected operation levels Energy management system Heating power monitoring Intelligent Profiling System (IPS) for high-end thermal profile control Automatic in- and outlet of the Work Piece Carrier Patented vibration and maintenance free transport system Two chamber design and medium recovery results in a very low fluid consumption Fluid level control and automatic filtering Patented vacuum chamber inside of the process chamber Controllable vacuum generation set up in steps, multi vacuum or linear mode Integrated fans with global bottom cooling Minimal maintenance and wear due to all moving parts mounted outside of the process chamber Easy access to solder chamber for cleaning and maintenance purposes Observation window into the solder chamber Exhaust connection Cool

Options: Process extensions • Infrared pre-heating • Vapour descent • Extended pcb cooling • Patented Rapid Cooling System (RCS) • Up to 3 additional temperature measurement channels • Multi-Level Mode for rapid switching between different soldering heights • Nitrogen flooting of the cooling and process chamber Software extensions • Online Temperature Recording Software (TRS) for data analysis and storage including alarm and event log • Pilot mode, measurement channel for easy temperature-controlled soldering and setting up of profiles • Various traceability extensions, for automated processes...