CX600/CX800

CX600/CX800

CX600/CX800

Product catalog summary
Overview: The CX600/CX800 Automatic Inline Vapour Phase Reflow Oven is designed for high-volume production and accommodates various board sizes. It operates in both inline and batch modes, featuring a patented Double Soft Vapour system that enhances throughput by using two work piece carriers simultaneously.
Key Features:
  • Touch screen display with integrated PC for ease of use.
  • Permanent data collection and unlimited program memory.
  • Energy management and heating power monitoring systems.
  • Network capability and password-protected operation levels.
  • Intelligent Profiling System (IPS) for precise thermal control.
  • Automatic loading/unloading and transport lane width adjustment.
  • Patented vibration-free transport system and low fluid consumption.
  • Integrated cooling fans and minimal maintenance requirements.
Options:
  • Infrared pre-heating and batch carrier options.
  • Online Temperature Recording Software for data analysis.
  • Multi-Level Mode for rapid soldering height adjustments.
  • Uninterruptable Power Supply (UPS) and exhaust system extensions.
Technical Specifications:
  • Dimensions: CX600 - Depth: 1980 mm, Length: 5950 mm, Height: 1500 mm; CX800 - Depth: 2390 mm, Length: 5950 mm, Height: 1500 mm.
  • Weight: CX600 - 1980 kg; CX800 - 2090 kg.
  • Max PCB size: Batch mode - CX600: 680 x 646 x 65 mm; CX800: 680 x 826 x 65 mm. Inline mode - CX600: 680 x 305 x 45 mm; CX800: 680 x 510 x 45 mm.
  • Max load on single carrier: 7 kg.
  • Liquid agent filling: CX600 - 40 kg; CX800 - 45 kg.
  • Max heating capacity: CX600 - 7.6 kW; CX800 - 10.4 kW.
  • Average power consumption: CX600 - 3.9 kW/h; CX800 - 5.3 kW/h.
  • Power supply: 400/230 VAC, 50/60Hz.
Conclusion: The CX600/CX800 series offers advanced features for efficient and high-quality soldering processes, suitable for various production needs with its flexible operation modes and robust design.
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Catalog excerpts

CX600/CX800-1

CX600/CX800 Automatic Inline Vapour Phase Reflow Oven SV260 The CX Series is a machine dedicated for high volume and a variety of board sizes. The machine is capable of running in inline or in batch mode. Patented Double Soft Vapour is a feature with simultaneously two work piece carriers thus improving the throughput. Thanks to its unique design it also works simultaneously with one work piece carrier being loaded automatically while the other one can be loaded manually. One solder chamber, two loading positions and heating chambers - each makes the machine perfect for high throughput allowing to reach cycle times of 20 seconds per assembly. Its size allows to load a large amount of boards simultaneously onto a work piece carrier thus letting them all get soldered in one go. While one carrier is in the solder chamber the second gets unloaded and at the same time loaded with fresh board again. Soldering is possible regardless of assembly weight with the same profile and with a high repeatability. Comfortable touch screen display with integrated PC Permanent data collection Unlimited program memory with a large amount of sample programs Pilot mode, measurement channel for easy temperature-controlled soldering and setting up of profiles Energy management system Heating power monitoring Network capable Password protected operation levels Intelligent Profiling System (IPS) for high-end thermal profile control Buffer in the loading and unloading area Automatic loading and unloading Work Piece Carrier Automatic adjustment of transport lane width and work piece carrier Signal light tower Patented vibration and maintenance free transport system Multiple chamber design and medium recovery results in a very low fluid consumption Fluid level control and automatic filtering Medium recovery system Integrated cooling fans Minimal maintenance and wear due to all moving parts mounted outside of the process chamber Cool handling – transport system in cool area Easy access to solder chamber for cleaning and maintenance purposes Observation window into the solder chamber Exhaust connection Several Emerg

 Open the catalog to page 1
CX600/CX800-2

Infrared pre-heating Batch carrier and stainless-steel grid Adapter for double sided boards for batch carrier Online Temperature Recording Software (VP-Control) for data analysis and storage Multi-Level Mode for rapid switching between different soldering heights within the vapour blanket Up to 2 measurement channels per Work Piece Carrier (WPC1 and WPC2) UPS – Uninterruptable Power Supply ReSy – a device for repair of QFPs and BGAs Exhaust system extensions Chiller for inside or outside use with automatic standby control Infrared / Cooling Process chamber Infrared / Cooling Technical data: CX600...

 Open the catalog to page 2

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