- Catalogs
- IBASE TECHNOLOGY
- EMBEDDED COMPUTING 2018
EMBEDDED COMPUTING 2018
1 / 148 PagesView full catalog
EMBEDDED COMPUTING 2018
Product catalog summary
IBASE Company Profile
IBASE Technology, established in 2000 and listed on the Taipei Exchange, is a prominent manufacturer of industrial computing platforms. Their product range includes single board computers, industrial motherboards, embedded systems, and panel PCs. The company prioritizes high-quality production and exceptional service, with a strong emphasis on research and development to deliver innovative products.
IBASE Technology, established in 2000 and listed on the Taipei Exchange, is a prominent manufacturer of industrial computing platforms. Their product range includes single board computers, industrial motherboards, embedded systems, and panel PCs. The company prioritizes high-quality production and exceptional service, with a strong emphasis on research and development to deliver innovative products.
Embedded Systems
The document describes various embedded systems, such as fanless systems, automatic control systems, and high-performance systems. Key product lines include the AGS series for Intel Atom, Pentium, and Celeron processors, and the AMS series for Intel Core processors. These systems are tailored for specific industrial applications, offering features like compactness, expandability, and fanless operation.
The document describes various embedded systems, such as fanless systems, automatic control systems, and high-performance systems. Key product lines include the AGS series for Intel Atom, Pentium, and Celeron processors, and the AMS series for Intel Core processors. These systems are tailored for specific industrial applications, offering features like compactness, expandability, and fanless operation.
CPU Modules
IBASE provides a variety of CPU modules, including QSeven, ETX, and COM Express types, supporting various Intel processors. These modules are designed for integration into custom systems, offering flexibility and performance for industrial applications.
IBASE provides a variety of CPU modules, including QSeven, ETX, and COM Express types, supporting various Intel processors. These modules are designed for integration into custom systems, offering flexibility and performance for industrial applications.
Motherboards
The document outlines several motherboard options, including ATX, Micro ATX, and Mini-ITX formats, supporting a wide range of Intel and AMD processors. These motherboards are designed for robust industrial use, offering features like extended temperature support and various form factors.
The document outlines several motherboard options, including ATX, Micro ATX, and Mini-ITX formats, supporting a wide range of Intel and AMD processors. These motherboards are designed for robust industrial use, offering features like extended temperature support and various form factors.
Manufacturing and R&D
IBASE operates two manufacturing sites in Taiwan, equipped with advanced facilities and certifications like ISO 9001 and ISO 14001. The company emphasizes strong R&D capabilities, with a team experienced in hardware and software integration, offering ODM and JDM services to meet diverse customer needs.
IBASE operates two manufacturing sites in Taiwan, equipped with advanced facilities and certifications like ISO 9001 and ISO 14001. The company emphasizes strong R&D capabilities, with a team experienced in hardware and software integration, offering ODM and JDM services to meet diverse customer needs.
Conclusion
IBASE Technology is positioned as a leader in the industrial PC market, with a comprehensive range of products and services designed to meet the needs of various industrial applications. Their commitment to quality, innovation, and customer service underpins their competitive advantage in the global market.
IBASE Technology is positioned as a leader in the industrial PC market, with a comprehensive range of products and services designed to meet the needs of various industrial applications. Their commitment to quality, innovation, and customer service underpins their competitive advantage in the global market.
Construction and Design
The document outlines various models of embedded systems, primarily constructed from aluminum and steel, with a consistent chassis color of Silver/Gray or Black. These systems are designed for both desktop and wall mounting, with some models offering optional VESA mounts.
The document outlines various models of embedded systems, primarily constructed from aluminum and steel, with a consistent chassis color of Silver/Gray or Black. These systems are designed for both desktop and wall mounting, with some models offering optional VESA mounts.
Environmental Specifications
Operating temperatures vary by model, with ranges from -40°C to 70°C for E-series CPUs and -20°C to 60°C for N-series CPUs. Storage temperatures are consistently between -20°C and 80°C. All models are certified with CE/FCC/LVD standards.
Operating temperatures vary by model, with ranges from -40°C to 70°C for E-series CPUs and -20°C to 60°C for N-series CPUs. Storage temperatures are consistently between -20°C and 80°C. All models are certified with CE/FCC/LVD standards.
System Specifications
The systems support a range of Intel processors, including 7th/6th Gen Intel® Core™ and Intel® Atom™ processors. Memory configurations vary, with maximum capacities ranging from 8GB to 32GB. Graphics are supported by various Intel® HD Graphics models.
The systems support a range of Intel processors, including 7th/6th Gen Intel® Core™ and Intel® Atom™ processors. Memory configurations vary, with maximum capacities ranging from 8GB to 32GB. Graphics are supported by various Intel® HD Graphics models.
I/O Interfaces
Display options include combinations of DVI, VGA, DisplayPort, and HDMI. Ethernet connectivity is provided by Intel® Gigabit LAN PHYs. Serial ports and USB configurations vary, with some models offering up to 4 USB 3.0 ports and 6 USB 2.0 ports.
Display options include combinations of DVI, VGA, DisplayPort, and HDMI. Ethernet connectivity is provided by Intel® Gigabit LAN PHYs. Serial ports and USB configurations vary, with some models offering up to 4 USB 3.0 ports and 6 USB 2.0 ports.
Storage and Expansion
Storage interfaces support 2.5" HDD or SSD, mSATA, and CFast sockets. Expansion slots include PCI Express and Mini PCI-E options, with power inputs ranging from 12V to 24V DC.
Storage interfaces support 2.5" HDD or SSD, mSATA, and CFast sockets. Expansion slots include PCI Express and Mini PCI-E options, with power inputs ranging from 12V to 24V DC.
Mechanical and Power Specifications
Dimensions and weights vary by model, with power protection features such as OVP, UVP, and reverse voltage protection available on some models.
Dimensions and weights vary by model, with power protection features such as OVP, UVP, and reverse voltage protection available on some models.
Applications
The systems are designed for smart factory applications and Industry 4.0, with capabilities for environmental monitoring, data acquisition, and communication with IoT cloud services. They support legacy PLC equipment and wireless sensor data transmission.
The systems are designed for smart factory applications and Industry 4.0, with capabilities for environmental monitoring, data acquisition, and communication with IoT cloud services. They support legacy PLC equipment and wireless sensor data transmission.
AGS Series IPC
The AGS series, including models AGS100 and AGS102, are intelligent IoT gateway systems designed for smart factories. They support Intel® Atom™, Pentium®, and Celeron® processors and are suitable for harsh environments. Key features include fanless design, wide operating temperature range (-40°C to 70°C), and compatibility with DIN-rail and wall mounts. They offer reliable communication between end devices and central servers, with options for legacy PLC equipment connection.
The AGS series, including models AGS100 and AGS102, are intelligent IoT gateway systems designed for smart factories. They support Intel® Atom™, Pentium®, and Celeron® processors and are suitable for harsh environments. Key features include fanless design, wide operating temperature range (-40°C to 70°C), and compatibility with DIN-rail and wall mounts. They offer reliable communication between end devices and central servers, with options for legacy PLC equipment connection.
AMS300 Series
The AMS300 series offers compact, modular, and expandable fanless systems with enhanced performance for factory automation. They support 7th/6th Gen Intel® Core™ processors and provide features like front removable drive bays, RAID support, and various fieldbus options. The systems are designed for efficient and smarter factory machine automation, with remote monitoring capabilities.
The AMS300 series offers compact, modular, and expandable fanless systems with enhanced performance for factory automation. They support 7th/6th Gen Intel® Core™ processors and provide features like front removable drive bays, RAID support, and various fieldbus options. The systems are designed for efficient and smarter factory machine automation, with remote monitoring capabilities.
Key Features
Both series emphasize rugged, fanless designs suitable for industrial environments, with wide temperature operating ranges and robust power input options. They are equipped with advanced features like iSMART and iAMT for enhanced system management and protection.
Both series emphasize rugged, fanless designs suitable for industrial environments, with wide temperature operating ranges and robust power input options. They are equipped with advanced features like iSMART and iAMT for enhanced system management and protection.
Applications
These systems are ideal for applications requiring fast detection and production, such as AOI machines, where time-deterministic control and high communication speeds are critical.
These systems are ideal for applications requiring fast detection and production, such as AOI machines, where time-deterministic control and high communication speeds are critical.
Fanless and Compact Systems
The document provides detailed specifications and features of various fanless and compact systems designed for industrial and automated applications. These systems support 7th/6th Gen Intel® Core™ i7/i5/i3 processors and are tailored for high-performance, space-constrained environments.
The document provides detailed specifications and features of various fanless and compact systems designed for industrial and automated applications. These systems support 7th/6th Gen Intel® Core™ i7/i5/i3 processors and are tailored for high-performance, space-constrained environments.
Specifications
The systems feature a range of processors with a TDP of 35W, base frequencies from 2.3 GHz to 3.4 GHz, and support for up to 32GB DDR4 memory. They include multiple expansion slots, such as PCI-E and Mini PCI-E, and offer various mounting options including desktop, wall, and DIN-rail mounting.
The systems feature a range of processors with a TDP of 35W, base frequencies from 2.3 GHz to 3.4 GHz, and support for up to 32GB DDR4 memory. They include multiple expansion slots, such as PCI-E and Mini PCI-E, and offer various mounting options including desktop, wall, and DIN-rail mounting.
Key Features
The systems are fanless, enhancing reliability and reducing maintenance. They support multiple independent display outputs, have flexible expansion slot systems, and offer over/under/reverse voltage protection. The systems are constructed from aluminum and steel, ensuring durability.
The systems are fanless, enhancing reliability and reducing maintenance. They support multiple independent display outputs, have flexible expansion slot systems, and offer over/under/reverse voltage protection. The systems are constructed from aluminum and steel, ensuring durability.
Environmental Specifications
Operating temperatures range from -10°C to 70°C with airflow, and storage temperatures from -20°C to 80°C. They are designed to withstand vibrations and shocks as per industry standards.
Operating temperatures range from -10°C to 70°C with airflow, and storage temperatures from -20°C to 80°C. They are designed to withstand vibrations and shocks as per industry standards.
Applications
These systems are ideal for smart manufacturing and machine automation, offering enhanced performance and production efficiency. They support high-precision image detection and processing, and are suitable for integration into automated equipment to reduce production costs and accelerate time to market.
These systems are ideal for smart manufacturing and machine automation, offering enhanced performance and production efficiency. They support high-precision image detection and processing, and are suitable for integration into automated equipment to reduce production costs and accelerate time to market.
Certifications
The systems are certified with CE, LVD, and FCC Class B, ensuring compliance with international safety and electromagnetic compatibility standards.
The systems are certified with CE, LVD, and FCC Class B, ensuring compliance with international safety and electromagnetic compatibility standards.
Fanless Box Systems
The document provides detailed specifications and features of various fanless box systems, primarily focusing on the AMI221, AMI222, and AMI210 series. These systems are designed for high performance and reliability, utilizing Intel® Core™ i7/i5/i3 desktop processors.
The document provides detailed specifications and features of various fanless box systems, primarily focusing on the AMI221, AMI222, and AMI210 series. These systems are designed for high performance and reliability, utilizing Intel® Core™ i7/i5/i3 desktop processors.
Specifications
- Processors: Supports 7th/6th Gen Intel® Core™ i7/i5/i3 for AMI221 and AMI222, and 4th Gen for AMI210.
- Memory: Up to 32GB DDR4 for AMI221/222 and up to 16GB DDR3 for AMI210.
- Storage: Includes options for 2.5” SSDs and mSATA drives.
- Construction: Made from aluminum and steel, with a silver and gray finish.
- Operating Temperature: Ranges from -10°C to 70°C with airflow, and -10°C to 50°C without airflow.
- Certifications: CE, LVD, FCC Class B.
Features
- Fanless and ventless design for silent operation.
- Wide-range voltage input (12V to 24V) with protection against over, under, and reverse voltage.
- iSMART and iAMT technologies for enhanced system management.
- Multiple I/O options including USB, COM ports, and DisplayPort connectors.
Expansion and Customization
- Supports various expansion cards including PCI and PCI-E slots.
- ODM/OEM customization options available.
Recommended ProcessorsThe document lists several Intel processors with details on TDP, base and turbo frequencies, cache size, and core/thread count.
Additional Information
- Systems are designed for desktop or wall mounting.
- Includes detailed dimensions and weight specifications.
- Optional items and expansion kits are available for further customization.
Mini-ITX Standard Systems
The document outlines the specifications for various Mini-ITX standard systems, focusing on the CMI211, CMI212, CMI203, and CMI222 system families. These systems are based on different I/O configurations such as MI991, MI990, MI981, MI980, MI982, MI805, MI808, and MI811. Key specifications include support for Intel processors ranging from 4th to 6th Gen Intel® Core™ i7/i5/i3, Pentium®, and Celeron® processors, with memory configurations supporting DDR3L and DDR4 SO-DIMM modules.
The document outlines the specifications for various Mini-ITX standard systems, focusing on the CMI211, CMI212, CMI203, and CMI222 system families. These systems are based on different I/O configurations such as MI991, MI990, MI981, MI980, MI982, MI805, MI808, and MI811. Key specifications include support for Intel processors ranging from 4th to 6th Gen Intel® Core™ i7/i5/i3, Pentium®, and Celeron® processors, with memory configurations supporting DDR3L and DDR4 SO-DIMM modules.
Environmental and Mechanical Specifications
The systems are designed to operate within a temperature range of 0°C to 45°C and can be stored between -20°C and 80°C. They support humidity levels of 5% to 90% at 45°C (non-condensing) and are certified with CE, LVD, and FCC Class B (Pre-scan only). The systems are constructed using SGCC or SECC materials and are available in black chassis, suitable for wall mount or desktop configurations.
The systems are designed to operate within a temperature range of 0°C to 45°C and can be stored between -20°C and 80°C. They support humidity levels of 5% to 90% at 45°C (non-condensing) and are certified with CE, LVD, and FCC Class B (Pre-scan only). The systems are constructed using SGCC or SECC materials and are available in black chassis, suitable for wall mount or desktop configurations.
Vibration and Certification
Non-operating vibration tolerance is 1.0 grms over 5~500Hz, while operating tolerance is 0.25 grms over the same frequency range. The systems are certified for CE, LVD, and FCC Class B (Pre-scan only).
Non-operating vibration tolerance is 1.0 grms over 5~500Hz, while operating tolerance is 0.25 grms over the same frequency range. The systems are certified for CE, LVD, and FCC Class B (Pre-scan only).
Ordering Information
The document provides detailed ordering information for various chassis configurations, including models like CMI211-991AFM, CMI212-991AFM, CMI203-991AFM, and CMI222-805M. These configurations specify the inclusion of components like riser cards, power supplies, and expansion slots, with options for ODM/OEM availability.
The document provides detailed ordering information for various chassis configurations, including models like CMI211-991AFM, CMI212-991AFM, CMI203-991AFM, and CMI222-805M. These configurations specify the inclusion of components like riser cards, power supplies, and expansion slots, with options for ODM/OEM availability.
Features
Highlighted features include support for multiple I/O interfaces, expansion slots, and storage options. The systems support various expansion slots such as PCI-E(x16), PCI-E(x8), and PCI, with additional features like Intel iAMT and TPM support for certain models. The systems are designed for long-term supply and support, with options for removable storage and RAID configurations.
Highlighted features include support for multiple I/O interfaces, expansion slots, and storage options. The systems support various expansion slots such as PCI-E(x16), PCI-E(x8), and PCI, with additional features like Intel iAMT and TPM support for certain models. The systems are designed for long-term supply and support, with options for removable storage and RAID configurations.
Industrial Embedded Controllers and Fanless Systems
The document outlines various industrial embedded controllers and fanless systems, detailing their specifications, features, and configurations. Key components include Intel® processors ranging from Core™ i3/i5/i7 to Atom™ series, with system speeds up to 3.96GHz. Memory configurations vary, with options for DDR3 and DDR4, supporting up to 32GB.
The document outlines various industrial embedded controllers and fanless systems, detailing their specifications, features, and configurations. Key components include Intel® processors ranging from Core™ i3/i5/i7 to Atom™ series, with system speeds up to 3.96GHz. Memory configurations vary, with options for DDR3 and DDR4, supporting up to 32GB.
System Features
These systems are designed for industrial applications, featuring fanless designs, wide operating temperature ranges, and robust construction using aluminum and steel. They support multiple I/O interfaces, including USB, COM ports, and Ethernet, and offer expansion slots for additional connectivity.
These systems are designed for industrial applications, featuring fanless designs, wide operating temperature ranges, and robust construction using aluminum and steel. They support multiple I/O interfaces, including USB, COM ports, and Ethernet, and offer expansion slots for additional connectivity.
Power and Mounting
Power supply options include industrial-grade ATX power supplies and optional adaptors, with input voltage ranges from 12V to 24V DC. Mounting options include desktop, wall, and VESA mounts, providing flexibility in installation.
Power supply options include industrial-grade ATX power supplies and optional adaptors, with input voltage ranges from 12V to 24V DC. Mounting options include desktop, wall, and VESA mounts, providing flexibility in installation.
Environmental Specifications
Operating temperatures range from -40°C to 70°C, depending on the model and storage type (HDD or SSD). Systems are certified for CE, LVD, and FCC Class B standards, ensuring compliance with safety and electromagnetic compatibility requirements.
Operating temperatures range from -40°C to 70°C, depending on the model and storage type (HDD or SSD). Systems are certified for CE, LVD, and FCC Class B standards, ensuring compliance with safety and electromagnetic compatibility requirements.
Ordering Information
The document provides detailed ordering information for various configurations, specifying processor types, memory, storage options, and included accessories. ODM/OEM services are available for customization.
The document provides detailed ordering information for various configurations, specifying processor types, memory, storage options, and included accessories. ODM/OEM services are available for customization.
CSB200-897 Model
The document provides detailed specifications and features of a fanless embedded system, specifically the CSB200-897 model, which utilizes the IBASE IB897 3.5” Disk-Size SBC. It highlights the system's construction, input/output options, expansion capabilities, and environmental tolerances.
The document provides detailed specifications and features of a fanless embedded system, specifically the CSB200-897 model, which utilizes the IBASE IB897 3.5” Disk-Size SBC. It highlights the system's construction, input/output options, expansion capabilities, and environmental tolerances.
SpecificationsThe system is built with aluminum and steel, featuring a black chassis. It supports up to 8GB of DDR3L memory and includes a variety of I/O ports such as USB 2.0, USB 3.0, DisplayPort, VGA, and COM ports. The system can accommodate a 2.5" HDD or SSD for storage and operates with an optional 60W power adaptor.
Environmental TolerancesThe system is designed to operate in temperatures ranging from -10°C to 50°C with an HDD, and -30°C to 60°C with an SSD. It can withstand vibrations and shocks, making it suitable for industrial environments.
FeaturesKey features include the iSMART technology for efficient power management, which offers functionalities like auto power on/off scheduling, power failure detection, and temperature monitoring. The system also supports wide-range DC power input (12V~24V) and includes a wall mount kit.
Ordering InformationTwo configurations are available: one with a 320GB SATA HDD and another with a 64GB industrial-grade SSD, both without the 60W power adaptor.
CertificationsThe system is certified with CE, LVD, FCC Class B, and CCC standards, ensuring compliance with safety and electromagnetic compatibility requirements.
COM Express CPU Modules
This document provides detailed specifications and ordering information for various COM Express CPU modules featuring Intel processors. It includes information on operating conditions, dimensions, and features of each module type.
This document provides detailed specifications and ordering information for various COM Express CPU modules featuring Intel processors. It includes information on operating conditions, dimensions, and features of each module type.
Specifications
- Operating Temperature: Ranges from -40°C to 85°C depending on the module.
- Storage Temperature: Ranges from -40°C to 90°C.
- Relative Humidity: 10% to 90% non-condensing.
- Dimensions: Vary by module, with common sizes being 95mm x 95mm and 95mm x 125mm.
Module Features
- ET875 Series: Features Intel Atom x7/x5 SoC, onboard LPDDR4 memory, and supports TPM 2.0 and eMMC 5.0.
- ET870 Series: Utilizes Intel Atom x7/x5 SoC with DDR3L memory, supporting dual independent displays and HD audio.
- ET860 Series: Equipped with Intel Atom E3845/E3827 SoC, supports multiple USB and SATA interfaces, and dual independent displays.
- ET975 Series: Features 7th Gen Intel Core U-series processors, supports multiple USB and PCI-E slots, and TPM 2.0.
- ET970 Series: Includes 7th Gen Intel Xeon/Core processors, supports up to 3 independent displays, and extensive PCI-E expansion.
- ET960 Series: Utilizes 5th Gen Intel Core i7 processors, supports multiple display interfaces, and extensive I/O options.
Ordering InformationEach series offers multiple configurations based on processor type, memory capacity, and display support. Options include different Intel processors and memory configurations, with some models offering eMMC storage.
Additional FeaturesAll modules support a wide range of operating temperatures, have integrated graphics, and offer various expansion slots and interfaces for connectivity.
COM Express CPU Modules and Carrier Boards
This document provides technical specifications and ordering information for various embedded systems, focusing on COM Express CPU modules and carrier boards. It includes details on the ET950 and ET930 series, as well as a comparison of different carrier boards.
This document provides technical specifications and ordering information for various embedded systems, focusing on COM Express CPU modules and carrier boards. It includes details on the ET950 and ET930 series, as well as a comparison of different carrier boards.
ET950 Series SpecificationsThe ET950 series features onboard 4th Gen Intel® Core™ i7/i5/i3 processors with a maximum of 16GB DDR3L SO-DIMM memory. It supports multiple interfaces including SATA, USB, and COM ports via the IP409 carrier board. The series supports three independent displays and HD audio.
ET930 Series SpecificationsThe ET930 series includes 2nd/3rd Gen Intel® Core™ i3/Celeron® processors, supporting up to 16GB DDR3 memory. It offers various interfaces through the IP402 carrier board, including SATA, USB, and COM ports, and supports multiple display outputs and HD audio.
Carrier Board ComparisonThe document compares several carrier boards, highlighting differences in form factors, display interfaces, LAN connectivity, audio capabilities, and expansion slots. Key features include support for various USB and SATA configurations, digital I/O, and power connectors.
IP419 Carrier BoardThe IP419 is a Mini-ITX COM Express Type 6 carrier board supporting multiple USB, SATA, and LAN interfaces. It features options for LVDS or eDP displays and includes a Fintek Super I/O chipset for additional COM ports. The board operates within a wide temperature range and supports 12V DC power input.
Ordering InformationSpecific models and configurations are available for each series and carrier board, with options for different processor types and display support.
Single Board Computers (SBCs) and Mini-ITX Motherboards
This document provides detailed specifications and features of various Single Board Computers (SBCs) and Mini-ITX motherboards, focusing on different generations of Intel and AMD processors. It includes information on system memory, expansion slots, display interfaces, LAN controllers, and power requirements.
This document provides detailed specifications and features of various Single Board Computers (SBCs) and Mini-ITX motherboards, focusing on different generations of Intel and AMD processors. It includes information on system memory, expansion slots, display interfaces, LAN controllers, and power requirements.
IB909 Series
- Features 5th Gen Intel® Core™ U-series processors with options for i7, i5, and i3.
- Supports up to 16GB DDR3L-1600 SO-DIMM memory.
- Includes dual PCI-E GbE LAN, DVI-I, and LVDS support.
- Offers multiple I/O options including USB 3.0, USB 2.0, COM ports, and SATA III.
- Operating temperature ranges from 0°C to 60°C.
IB908 Series
- Utilizes 4th Gen Intel® Core™ U-series processors with i7, i5, and Celeron options.
- Similar memory and I/O capabilities as the IB909 series.
- Includes iSMART and iAMT for enhanced management and power saving.
IB906 and IB905 Series
- IB906 features Intel® Celeron® 807UE processors, while IB905 supports 3rd Gen Intel® Core™ processors.
- Both support up to 8GB DDR3 memory and offer extensive I/O options.
- Designed for a wide range of operating temperatures and include iSMART technology.
IB904 and IB903 Series
- Powered by AMD Embedded G-series SoC with various processor options.
- Supports up to 8GB DDR3/DDR3L memory and includes dual PCI-E Gigabit LAN.
- Features include mSATA, iSMART, and a range of I/O ports.
Mini-ITX Motherboards
- Comparison of models MB995, MB990, MB980, MB970, MB960, MB950, MB991, and MB961.
- Details on CPU socket types, supported CPU generations, and maximum memory capacity.
- Includes chipset information and memory socket configurations.
Key Takeaways
- The document highlights the versatility and adaptability of the SBCs and motherboards for various applications.
- Emphasizes the importance of iSMART technology for power management and efficiency.
- Provides comprehensive ordering information for each product series.
Intel-based ATX and Micro ATX Motherboards
This document provides detailed specifications and features of various Intel-based ATX and Micro ATX motherboards, highlighting their compatibility with different generations of Intel processors, memory capacities, expansion slots, and other integrated features.
This document provides detailed specifications and features of various Intel-based ATX and Micro ATX motherboards, highlighting their compatibility with different generations of Intel processors, memory capacities, expansion slots, and other integrated features.
MB990 ATX Motherboard
- Supports 7th/6th Gen Intel Core i7/i5/i3, Pentium, and Celeron processors up to 4GHz.
- Memory: 4x DDR4 DIMM, Max. 64GB, ECC compatible.
- Graphics: Integrated with support for DVI-D, HDMI, and DisplayPort.
- LAN: Dual Intel Gigabit LAN.
- Expansion: 1x PCI-E(x16), 1x PCI-E(x8), 1x PCI-E(x4), 1x PCI-E(x1), 3x PCI, 1x Mini PCI-E.
- Additional Features: Watchdog timer, Digital I/O, iAMT(11.0), TPM(1.2), vPro, iSMART.
MB980 ATX Motherboard
- Supports 4th Gen Intel Core i7/i5/i3, Pentium processors up to 3.4GHz.
- Memory: 4x DDR3 DIMM, Max. 32GB.
- Graphics: Integrated with support for DVI-I, DVI-D, and DisplayPort.
- LAN: Dual Intel Gigabit LAN.
- Expansion: 4x PCI, 1x PCI-E(x16), 1x PCI-E(x4), 1x PCI-E(x1).
- Additional Features: Watchdog timer, Digital I/O, iAMT(9.0), vPro, iSMART.
MB970 ATX Motherboard
- Supports 3rd Gen Intel Core i7/i5/i3, Pentium processors up to 3.4GHz.
- Memory: 4x DDR3 DIMM, Max. 32GB.
- Graphics: Integrated with support for DVI-I, DVI-D, and DisplayPort.
- LAN: Dual Intel Gigabit LAN.
- Expansion: 1x ISA, 3x PCI, 1x PCI-E(x16), 3x PCI-E(x1).
- Additional Features: Watchdog timer, Digital I/O, iAMT(8.0), vPro, iSMART.
MB960 ATX Motherboard
- Supports 2nd/3rd Gen Intel Core i7/i5/i3, Pentium, Celeron processors up to 3.4GHz.
- Memory: 4x DDR3 DIMM, Max. 32GB.
- Graphics: Integrated with support for DVI-I, DVI-D, HDMI.
- LAN: Dual Gigabit LAN.
- Expansion: 4x PCI, 1x PCI-E(x16), 1x PCI-E(x4), 1x ISA (Slave).
- Additional Features: Watchdog timer, Digital I/O, EuP/ErP compliance.
MB950 ATX Motherboard
- Supports Intel Core i7/i5/i3 and Pentium processors, 2.8GHz ~ 3.46GHz.
- Memory: 4x DDR3 DIMM, Max. 16GB.
- Graphics: Supports dual independent display; DVI-D/VGA.
- LAN: 1x Gigabit MAC + PHY and 1x PCI-E Gigabit LAN.
- Expansion: 1x PCI-E(x16), 1x PCI-E(x4), 1x PCI-E(x1), 4x PCI, 1x ISA.
- Additional Features: Digital I/O (4-in/4-out).
MB991 Micro ATX Motherboard
- Supports 7th/6th Gen Intel Xeon E3/Core i7/i5/i3, Pentium, Celeron processors up to 4.2GHz.
- Memory: 4x DDR4 DIMM, Max. 64GB, ECC support.
- Graphics: Integrated with support for HDMI, LVDS.
- LAN: Dual Intel Gigabit LAN.
- Expansion: 1x PCI-E(x16), 1x PCI-E(x8), 1x PCI-E(x4), 1x Mini PCI-E, 1x M.2 (2280).
- Additional Features: Watchdog timer, Digital I/O, iAMT(11.6), TPM(2.0), iSMART.
MB961 Micro ATX Motherboard
- Supports 3rd Gen Intel Core i7/i5/i3, Pentium, Celeron processors up to 3.4GHz.
- Memory: 2x DDR3 DIMM, Max. 16GB.
- Graphics: Integrated with support for HDMI, DVI-I, LVDS.
- LAN: Intel 82579V Gigabit LAN, Realtek RTL8111E Gigabit LAN.
- Expansion: 1x PCI-E(x16), 1x PCI-E(x8) [PCI-E(x4) Link], 2x PCI.
- Additional Features: Watchdog timer, Digital I/O, iSMART.
Mini-ITX Motherboards
The document provides a detailed comparison of various Mini-ITX motherboards, focusing on specifications such as CPU socket types, supported CPU generations, chipset models, memory configurations, and additional features.
The document provides a detailed comparison of various Mini-ITX motherboards, focusing on specifications such as CPU socket types, supported CPU generations, chipset models, memory configurations, and additional features.
SpecificationsThe motherboards support a range of CPU sockets including LGA1150, BGA 1364, and BGA 1440, with compatibility for Intel Core i7/i5/i3, Pentium, Celeron, and AMD Embedded Zen Core processors. CPU speeds vary from 2.7GHz to 4.2GHz. Chipsets include Intel Q87, H81, QM87, and others, with memory support for DDR3 and DDR4 SO-DIMM sockets, allowing up to 32GB of RAM.
Graphics and DisplayIntegrated graphics are provided by Intel Core i processors, with shared memory up to 1024MB. Display outputs include DVI, HDMI, and DisplayPort, with some models supporting LVDS and eDP.
ConnectivityLAN options feature Intel Gigabit LAN PHY and PCI-E Gigabit LAN. Audio is supported by built-in HD audio codecs like ALC892 and ALC662. USB configurations vary, with options for USB 3.0, USB 2.0, and USB 3.1 ports.
Storage and ExpansionSATA ports range from SATA II to SATA III, with mSATA and M.2 SSD support. Expansion slots include PCI-E and Mini PCI-E, with power connectors typically of the ATX type.
Additional FeaturesFeatures such as iAMT, LAN Wakeup, TPM, and iSMART are common across models, with some supporting RAID and EuP/ErP standards. Watchdog timers and digital I/O are also included.
Power and DimensionsPower requirements are specified for various CPU configurations, with dimensions consistently at 170mm x 170mm. Extra features include hardware monitoring and watchdog timers with 256 levels.
Mini-ITX Motherboards with Intel Processors
This document provides detailed specifications and features of various Mini-ITX motherboards equipped with Intel processors, including Pentium, Celeron, Xeon, and Core series. The document outlines the technical specifications, supported interfaces, and ordering information for each motherboard model.
This document provides detailed specifications and features of various Mini-ITX motherboards equipped with Intel processors, including Pentium, Celeron, Xeon, and Core series. The document outlines the technical specifications, supported interfaces, and ordering information for each motherboard model.
SpecificationsThe motherboards support a range of Intel processors, including Pentium N4200, Celeron N3350, N3710, N3010, J1900, and 8th Gen Xeon/Core i7/i5/i3. They feature DDR3L or DDR4 SO-DIMM sockets with a maximum capacity of 8GB or 32GB, depending on the model. Display interfaces include HDMI, DVI-D, eDP, and LVDS. LAN connectivity is provided by Intel I211-AT or I219LM/V Gigabit LAN controllers.
Expansion and ConnectivityThe motherboards offer various expansion slots, including PCI-E, Mini PCI-E, mSATA, and M.2. USB connectivity includes USB 3.0, USB 3.1, and USB 2.0 ports. Serial ATA interfaces support SATA III, and audio is managed by integrated Intel SoC or PCH with Realtek codecs.
Features and OptionsKey features include watchdog timers, digital I/O, TPM (2.0), iSMART, and iAMT for remote management. The motherboards support RAID configurations and are available with different power input options, including ATX and DC-in.
Environmental SpecificationsOperating temperatures range from 0°C to 60°C, with storage temperatures from -20°C to 80°C. The relative humidity tolerance is up to 90% non-condensing at 60°C.
Ordering InformationThe document lists various models with specific configurations, including MI811, MI808, MI805, MI995, and MI992 series, each with distinct processor options and features tailored for different applications.
Mini-ITX Motherboards with Intel and AMD Processors
This document provides detailed specifications and features of various Mini-ITX motherboards, including models with Intel and AMD processors. It covers aspects such as supported processors, memory capacity, expansion slots, and connectivity options.
This document provides detailed specifications and features of various Mini-ITX motherboards, including models with Intel and AMD processors. It covers aspects such as supported processors, memory capacity, expansion slots, and connectivity options.
MI970 SeriesThe MI970 series supports 3rd Gen Intel Core i7/i5/i3/Celeron processors with features like dual Gigabit LAN, multiple display interfaces (DVI-I, DVI-D, DisplayPort), and extensive USB and SATA connectivity. It includes models like MI970VF and MI970F, differing mainly in chipset and additional features like TPM and vPro.
MI961 SeriesThis series supports 2nd/3rd Gen Intel processors and offers features such as dual Gigabit LAN, HDMI, DVI-D, and VGA support. It includes a PCI-E(x16) slot and a Mini PCI-E slot, with a focus on power-saving technologies like iSMART.
MI956 SeriesDesigned for 2nd/3rd Gen Intel processors, this series includes features like dual Gigabit LAN, multiple USB ports, and support for various display interfaces. It offers models with RAID support and iAMT technology.
MI988 SeriesFeaturing AMD Ryzen Embedded V1000 processors, this series supports up to 32GB DDR4 memory and includes advanced display options like HDMI 2.0a and DisplayPort 1.4. It also offers high-speed USB 3.1 connectivity and multiple expansion slots.
MI979 SeriesThis series supports AMD R/G-series APUs with features like dual Gigabit LAN, HDMI, DisplayPort, and extensive USB and COM port options. It supports ECC memory and includes a SIM card slot for additional connectivity.
MI963 SeriesFeaturing AMD Embedded G-Series SoC, this series supports dual HDMI outputs and offers a PCI-E(x8) slot. It is designed for applications requiring robust connectivity and multimedia capabilities.
Comparison TableThe document includes a comparison table for various models, highlighting differences in form factor, CPU socket, chipset, memory capacity, and graphics capabilities.
General SpecificationsAll models share common features like a 170mm x 170mm form factor, operating temperature range of 0°C to 60°C, and storage temperature range of -20°C to 80°C. They also support high humidity conditions up to 90% non-condensing.
Intel-based Full-size CPU Cards
The document provides detailed specifications and features of various Intel-based full-size CPU cards, focusing on models such as IB960, IB965, IB970, IB980, IB981, and IB990. These cards are designed for high-performance computing applications, supporting a range of Intel processors and offering extensive connectivity and expansion options.
The document provides detailed specifications and features of various Intel-based full-size CPU cards, focusing on models such as IB960, IB965, IB970, IB980, IB981, and IB990. These cards are designed for high-performance computing applications, supporting a range of Intel processors and offering extensive connectivity and expansion options.
Specifications
- LAN: Multiple models feature Intel Gigabit LAN PHYs, including the 82583V, I217LM, I217V, I211AT, and I219LM, providing robust network connectivity.
- Audio: Integrated ALC662 HD audio codec supporting 5.1 channel audio.
- SATA Ports: Configurations vary from 2 to 6 SATA III ports, with some models also including SATA II ports.
- USB Ports: A mix of USB 2.0 and USB 3.0 ports are available, with options for additional ports via backplane.
- Expansion Slots: Include Mini PCI-E sockets and various PCI and PCI-E configurations for additional hardware integration.
- Power Requirements: Detailed power consumption metrics are provided for different CPU configurations, highlighting the efficiency and power needs of each setup.
- Dimensions: Standard dimensions are 338mm x 126mm, ensuring compatibility with standard enclosures.
Features
- RAID Support: Various RAID configurations (0, 1, 5, 10) are supported, enhancing data redundancy and performance.
- iAMT and TPM: Advanced management technologies like Intel Active Management Technology (iAMT) and Trusted Platform Module (TPM) are included for enhanced security and remote management.
- Watchdog Timer: Provides 256 levels of system monitoring to ensure reliability and uptime.
- Digital I/O: Offers 4-in/4-out digital I/O for additional control and monitoring capabilities.
ComparisonThe document includes a comparison table highlighting differences in form factor, CPU socket, chipset, memory, and other key features across different models, aiding in selecting the appropriate model for specific needs.
Additional InformationThe document also mentions the availability of ODM/OEM services, allowing for customization and tailored solutions to meet specific customer requirements.
CPU Cards and Backplanes
The document outlines various CPU cards and backplanes, focusing on Intel® Core™ processors across different generations. Key specifications include CPU socket types (LGA1155, LGA1150), system memory capacity (up to 16GB DDR3), and integrated graphics support. The cards support multiple display interfaces such as CRT, DVI-D, and LVDS, and feature dual Intel® Gigabit LAN.
The document outlines various CPU cards and backplanes, focusing on Intel® Core™ processors across different generations. Key specifications include CPU socket types (LGA1155, LGA1150), system memory capacity (up to 16GB DDR3), and integrated graphics support. The cards support multiple display interfaces such as CRT, DVI-D, and LVDS, and feature dual Intel® Gigabit LAN.
Power and Environmental RequirementsThe maximum power requirements vary by model, with typical configurations including Intel® Core™ i7 processors and DDR3 memory. Operating temperatures range from 0°C to 60°C, with storage temperatures from -20°C to 80°C. Relative humidity is specified at 90% non-condensing at 60°C.
Features and ExpansionThe CPU cards offer features like iSMART for power saving, TPM for security, and RAID support on select models. Expansion options include Mini PCI-E slots and multiple USB ports (USB 2.0 and USB 3.0). The backplanes provide various PCI-E and PCI slots for additional connectivity.
Ordering InformationThe document provides detailed ordering information for different models, including IB965RF, IB970RF, and IB981AF, among others. Each model is associated with specific features and chipset configurations.
Contact InformationIBASE Technology's contact details are provided for various global offices, including locations in the USA, Europe, Italy, Singapore, Japan, India, and China.
See more
Catalog excerpts
EMBEDDED COMPUTING 2018 Edition Embedded Computing 2018 Edition
Open the catalog to page 1
IBASE Company Profile IIoT Industry 4.0 Solutions Introduction 1-2—1-3 Advanced Gateway DIN-Rail Fanless System AGS100 Ultra-Compact Fanless System for Intel® Atom™ x7/x5, Pentium® & Celeron® Processors AGS102 Ultra-Compact Fanless System for Intel® Atom™ x7/x5, Pentium® & Celeron® Processors Compact Expandable Fanless System AMS300 Expandable Fanless & Compact System for 7th/6th Gen Intel® Core™ i7/i5/i3 Desktop Processors 1-16—1-17 AMS301 Expandable Fanless & Compact System for 7th/6th Gen Intel® Core™ i7/i5/i3 Desktop Processors 1-18—1-19 AMS302 Expandable Fanless...
Open the catalog to page 2
CMI211-250-956F-L Expandable Type system for IBASE MI956F Mini-ITX Motherboard 1-46 CMI221-981 Expandable type system for IBASE MI981AF Mini-ITX board 1-47 ET839 Intel® Atom™ Processor E3845 SoC ETX CPU Module 2-5 Intel® Atom™ x7/x5 SoC COM Express Type 10 (R3.0) CPU Module Intel® Atom™ x7 x5 SoC COM Express Type 6 (R3.0) CPU Module Intel® Atom™ Processor E3845/E3827 SoC COM Express (Type 6) CPU Module 7th Gen Intel® Core™ U-series Processor COM Express (Type 6) CPU Module 7th Gen Intel® Xeon® E3 / Core™ i7/i5/i3 COM Express (Type 6) CPU Module w/ Intel® QM175 & CM238 PCH 5th...
Open the catalog to page 3
Table of Contents COM Express Type 10 Carrier Board ATX COM Express Type 6 Carrier Board COM Express Type 6 Carrier Board COM Express Type 6 carrier board COM Express Type 6 carrier board 3. Disk-Size SBCs 3.5" Disk-Size SBCs Comparison Table 3-1~3-4 Intel® Pentium® / Celeron® / Atom™-Based IB818 (i-Temp) Intel® Atom™ x7/ Pentium®/ Celeron® SoC 3.5-inch Disk Size SBC 3-5~3-6 IB811 (i-Temp) Intel® Atom™ x7/x5 Pentium® & Celeron® SoC 3.5-inch Disk-Size SBC 3-7~3-8 IB898 (i-Temp) Intel® Atom™ Processor E3825/E3815 SoC 3.5-inch Disk Size SBC 3-9 IB897 (i-Temp) Intel® Atom™...
Open the catalog to page 4
8th Gen Intel® Xeon® E / Core™ i7/i5/i3 -Based MB995 8th Gen Intel® Xeon® E / Core™ i7/i5/i3 processor ATX Motherboard w/ Intel® C246/ Q370 PCH MB990 7th/6th Gen Intel® Core™ i7/i5/i3 and Pentium®/Celeron® ATX Motherboard w/ Intel® Q170 PCH MB980 4th Gen Intel® Core™ i7/i5/i3/ Pentium® ATX Motherboard w/ Intel® Q87 PCH MB970 3rd Gen Intel® Core™ i7/i5/i3/ Pentium® ATX Motherboard w/ Intel® Q77 PCH MB960 2nd/3rd Gen Intel® Core™ i7/i5/i3/ Pentium® / Celeron® ATX Motherboard w/ Intel® Q67 PCH MB950 Intel® Core™ i7/i5/i3 ATX Motherboard w/ Intel® Q57 PCH MB991 7th/6th Gen Intel®...
Open the catalog to page 5
3rd/2nd Gen Intel® Core™ i7/i5/i3-Based MI970 3rd Gen Intel® Core™ i7/i5/i3/Celeron® Mini-ITX Motherboard w/ Intel® QM77 PCH 4-27 MI961 2nd/3rd Gen Intel® Core™ i7/i5/i3 / Pentium® / Celeron® Mini-ITX Motherboard w/ Intel® H61 PCH 4-28 MI956 2nd/3rd Gen Intel® Core™ i7/i5/i3/ Celeron® Mini-ITX Motherboard w/ Intel® QM67 PCH 4-29 AMD Embedded V1000 series-Based MI988 AMD Ryzen™ Embedded V1000 Mini-ITX Motherboard 4-30 AMD G-Series / R-Series-Based MI979 AMD Embedded R-series /G-series SoC Mini-ITX Motherboard 4-31 MI963 AMD Embedded G-Series SoC Mini-ITX...
Open the catalog to page 6
| Company Profile Core Activities Design and Manufacture of Robust Industrial Computing Platforms Location_ Taipei, Taiwan Stock Quote TPEx 8050 (Since 2003) IBASE Technology is a reputable manufacturer and supplier of single board computers, industrial motherboards, embedded systems and panel PCs in the Industrial PC market. Since its establishment in 2000, IBASE has been committed to the production of high quality products, and to the rendering of excellent services. The company is publicly listed in the Taipei Exchange (TPEx: 8050) and is now a leading global provider of innovative industrial...
Open the catalog to page 7
Research & Development R&D Capabilities IBASE's R&D team boasts of talented electronics, layout, system, mechanical hardware, BIOS, firmware as well as software engineers. Half of the team members are seasoned with more than 15 years of experience in their respective fields, while the other 45 percent carry more than five years of experience. Because of their accumulated expertise, the R&D team is able to design and create new products for the demanding and dynamic market. Faithfully deliver according to the R&D, the Core Competence of IBASE period, the team also collaborates with the most respectable...
Open the catalog to page 8
Manufacturing IBASE Technology has two manufacturing sites, one in Sanchung and another one in Hsinchuang, New Taipei City, certification. IBASE factories are designed with anti-static protection using ESD floor protection and proper grounding Hsinchuang New Taipei City ● System Assembly ● Validation Capacity SMT Lines x 3 DIP Assembly Lines x 2 System Assembly Lines x 5 Burn-in Rooms x 7 (4 hours per run) Clean Rooms x 2 Sanchung New Taipei City ● Board Production ● System Assembly ● Validation Advanced Manufacturing Facilities At the Sanchung Factory ENVIRONMENTAL TEST CHAMBERS IBASE Manufacturing...
Open the catalog to page 9
IIOT IBASE IIoT Industry 4.0 Solutions IoT Cloud Level Wireless Networking IIoT Automation Cloud
Open the catalog to page 10
Automation Equipment Level IIOT Communication Level Robotic-Arm Control AMI220 Series AMS300 Series Robot Solution Data Extraction Conversion Field Protocols Connection Factory Automation ASB200 Series CSB200 Series Softlogic Controller Profibus Profinet Machine Automation AMI220 Series (CNC Controller) AMS300 Series (EtherCAT Master Controller) CMI212 Series (Machine Controller) CMI203 Series (Bender Machine)
Open the catalog to page 11
Comparison Table Embedded System NO iBASE Remarks: 1. Specifications are subject to change without prior notice. 2. ODM/OEM is available. 3. For user’s manual & datasheet download, visit
Open the catalog to page 12All IBASE TECHNOLOGY catalogs and technical brochures
FWA85062 Pages
FWA6706D1 Page
FWA51041 Page
FWA66041 Page
FWA6304-D251 Page
Expansion Module Cards2 Pages
MBN9001 Page
MBN8021 Page
MB9681 Page
MB9671 Page
MB8391 Page
MBN800-8L_6L1 Page
MB837-D251 Page
MBN5001 Page
MB8381 Page
IDOOH-210-IR3 Pages
MI9871 Page
MI9951 Page
Embedded Products124 Pages
Embedded Products133 Pages
IB7921 Page
MI9581 Page
MI9591 Page
MI9701 Page
EB9001 Page
MB9701 Page
iPPC-17001 Page
iPPC15A7-RE1 Page
iPPC12A7-RE1 Page
iOPS-761 Page
SI-581 Page
SI-561 Page
SI-381 Page
SI-28T1 Page
SI-24SD1 Page
SI-181 Page
SI-081 Page
AFB100-D251 Page
Archived catalogs
Panel Computers50 Pages
Digital Signage Players_201536 Pages
Network Appliances_201532 Pages
Panel Computers_201444 Pages
Network Appliances30 Pages
Digital Signage Players28 Pages
*Prices are pre-tax. They exclude delivery charges and customs duties and do not include additional charges for installation or activation options. Prices are indicative only and may vary by country, with changes to the cost of raw materials and exchange rates.