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Hynix
Catalog excerpts
Flexible and fast mobile storage, bringing the smart world to your fingertips The Best Solution for Smartphones and Automotive Competitive chip size 11x13mm and 1.0T(~1TB) High performance with optimized power consumption Features ·SK hynix’s UFS4.0 devices provide the highest performance with latest V7 4D NAND combined with next gen SoC ·Competitive Device Thickness UFS4.0 1TB – 1.0T ·SK hynix’s 1st Automotive 176 layer 4D TLC UFS3.1/2.1 with the fast speed, higher performance and reliability Chip size Model Name Technical Specification Interface Application Performance Sequential Read Sequential Write(WB) Feature Speed Operating Temp Applications Mobile UFS: Flexible and fast mobile storage, bringing the smart world to your fingertips http://product.skhynix.com www.linkedin.com/company/sk-hynix © 2023 SK hynix Inc. All Rights Reserved. Specifications and designs are subject to change without notice. All data were deemed correct at time of creation. SK hynix is not liable for errors or omissi
Open the catalog to page 1All Hynix catalogs and technical brochures
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PC8012 Pages
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eMMC2 Pages
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CXL8 Pages
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MCP2 Pages
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DDR5 RDIMMs2 Pages
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DDR5 DIMM for Server2 Pages
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DDR SDRAM Device Operation36 Pages
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DDR2 SDRAM Device Operations62 Pages
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DDR3L SDRAM Device Operation147 Pages
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DDR4 SDRAM Device Operation266 Pages
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NAND Flash10 Pages
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Mobile Memory5 Pages
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Graphics Memory5 Pages
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Consumer Memory7 Pages
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Computing Memory24 Pages
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Product catalogue12 Pages
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2013 Databook28 Pages
